5CGXFC7C6F23I7N

The 5CGXFC7C6F23I7N is an Intel Cyclone V GX series FPGA supplied in a 484-FBGA (23×23) package. It targets industrial and bandwidth-conscious applications that require a balance of logic capacity, on-chip memory, and high-density I/O in a surface-mount form factor.

As part of the Cyclone V family, the device is built on TSMC's 28‑nm low‑power process and aligns with Cyclone V architectural features—providing low-voltage core operation, integrated transceiver and memory controller capabilities, and scalable FPGA fabric for embedded logic and signal processing tasks.

Key Features

• Logic Capacity  Approximately 149,500 logic elements available for implementing custom digital logic, control, and signal-processing functions.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM (7,880,704 total RAM bits) for frame buffering, lookup tables, and temporary data storage.
• I/O and Package  240 general-purpose I/O pins in a 484-FBGA (23×23) package, optimized for high-density board designs and flexible interfacing.
• Power and Core Voltage  Core supply operating range of 1.07 V to 1.13 V consistent with the Cyclone V 1.1 V core architecture for low-voltage operation.
• Operating Temperature  Industrial-grade operation from −40 °C to 100 °C for deployment in temperature‑constrained environments.
• Mounting  Surface-mount device suitable for standard PCB assembly processes.
• Cyclone V Family Capabilities  Family-level features include 8‑input adaptive logic modules, variable‑precision DSP blocks, M10K memory blocks with error-correction support, and integrated transceivers and hard memory controllers as documented for Cyclone V devices.
• Regulatory  RoHS-compliant component.

Typical Applications

• Industrial Control  Real-time logic, deterministic control, and interface bridging in factory automation and process-control systems that benefit from industrial temperature range and high I/O density.
• Wireless and Wireline Infrastructure  Data path processing, protocol bridging, and interface aggregation where integrated transceivers and on-chip memory help manage bandwidth and latency.
• Militarized Electronics  Embedded processing and I/O expansion in defense-grade systems that require robust temperature performance and configurable logic.

Unique Advantages

• High logic density: 149,500 logic elements enable complex designs and substantial on-chip integration to reduce external components.
• Substantial embedded memory: Approximately 7.88 Mbits of RAM supports buffering, packet processing, and intermediate data storage without heavy external memory dependency.
• Industrial temperature rating: Specified operation from −40 °C to 100 °C for reliable performance in demanding environments.
• Compact, high‑pin package: 484-FBGA (23×23) with 240 I/O supports dense routing and multiple peripheral interfaces on space-constrained PCBs.
• Low-voltage core operation: 1.07–1.13 V supply range aligns with 1.1 V Cyclone V core architecture to support low-power system designs.
• Family-level integration: Cyclone V device features such as adaptive logic modules, variable-precision DSP blocks, integrated transceivers, and hard memory controllers enable efficient system partitioning between hardware and firmware.

Why Choose 5CGXFC7C6F23I7N?

This Cyclone V GX FPGA balances sizeable logic capacity and embedded memory with a robust industrial temperature range and a high-density 484‑FBGA package. It is suited for engineers seeking a configurable hardware platform where integration, lower-voltage operation, and flexible I/O are key priorities.

Choose this device when your design requires scalable FPGA fabric for signal processing or protocol handling, substantial on-chip RAM to minimize external memory, and a package that supports high I/O counts—all supported by the Cyclone V family architecture and manufacturing process.

If you need pricing, availability, or a formal quote for 5CGXFC7C6F23I7N, request a quote or submit an inquiry to receive details on lead time and purchasing options.