5CGXFC7C6F23C7N

The 5CGXFC7C6F23C7N is an Intel Cyclone® V GX Field Programmable Gate Array (FPGA) supplied in a 484-FBGA (23×23) surface-mount package. This device combines a high logic density with embedded RAM and interfaces intended for cost- and power-sensitive applications that require integrated transceivers and hard memory controllers.

Key on-chip specifications include approximately 149,500 logic elements, approximately 7.88 Mbits of embedded memory, and 240 I/Os. The device operates from a core supply range of 1.07 V to 1.13 V and is rated for commercial temperature operation from 0 °C to 85 °C. It is RoHS compliant.

Key Features

• Logic Capacity 
  Approximately 149,500 logic elements to implement complex custom logic, state machines, and protocol handling.
• On‑chip Memory 
  Approximately 7.88 Mbits of embedded memory for buffering, local storage, and micro-architecture resources.
• I/O and Package 
  240 general-purpose I/Os in a 484-FBGA (23×23) surface-mount package, suitable for dense board-level integration.
• Core Supply 
  Specified operating voltage range of 1.07 V to 1.13 V (typical 1.1 V core), enabling predictable power budgeting for system designs.
• Process and Power 
  Built on a 28 nm low-power process (Cyclone V family), delivering reduced power consumption compared with previous generations.
• Integrated High-Speed Interfaces 
  Cyclone V devices are enhanced with integrated transceivers and hard memory controllers; the family supports transceiver data rates such as 3.125 Gbps and 6.144 Gbps.
• Commercial Temperature Grade 
  Rated for operation from 0 °C to 85 °C and intended for commercial applications.
• Compliance 
  RoHS compliant to support restricted-substance requirements.

Typical Applications

• Broadband and Wired/Wireless Infrastructure 
  Use the device’s integrated transceivers and memory controllers to implement protocol bridging, packet buffering, and interface conversion for network equipment.
• Embedded Systems and Compute Acceleration 
  Deploy logic density and embedded RAM for hardware acceleration, custom datapaths, and offload of compute-intensive tasks in commercial embedded platforms.
• High‑Speed Memory Interfaces 
  Leverage on-chip memory and hard memory controllers to build external memory interfaces and buffering functions for data‑centric applications.
• Commercial Control and I/O Aggregation 
  Use the 240 I/Os and dense package footprint to consolidate control logic, sensor interfacing, and I/O management in compact commercial products.

Unique Advantages

• High Logic Density: Approximately 149,500 logic elements support complex, multi-function designs without immediate migration to larger device families.
• Integrated Interfaces: Built-in transceivers and hard memory controllers reduce external component count and simplify high-speed connectivity.
• Predictable Power Envelope: 1.07 V–1.13 V core supply range and 28 nm low-power process enable tighter power budgeting for system-level design.
• Compact, Board-Friendly Package: 484-FBGA (23×23) surface-mount packaging provides a small footprint for space-constrained PCBs while offering 240 I/Os.
• Commercial Availability and Compliance: Commercial-grade temperature rating and RoHS compliance make procurement and regulatory tracking straightforward for commercial products.

Why Choose 5CGXFC7C6F23C7N?

The 5CGXFC7C6F23C7N Cyclone® V GX FPGA offers a balance of logic capacity, embedded memory, and integrated high-speed interfaces in a compact 484-FBGA package. It is suited to commercial designs that require significant programmable logic, on-chip buffering, and multiple I/Os while maintaining a controlled power profile.

This device is appropriate for engineers and teams building cost- and power-conscious systems who need an FPGA solution with fixed core supply characteristics, RoHS compliance, and a commercial operating temperature range. Its combination of logic density, embedded memory, and interface integration helps simplify board-level design and shorten time to market.

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