5CGXFC7B6M15I7

The 5CGXFC7B6M15I7 is a Cyclone® V GX field-programmable gate array (FPGA) in a 484-LFBGA (484-MBGA, 15×15) surface-mount package, offered in an industrial grade. It delivers high logic density and on-chip memory suitable for complex, cost-sensitive designs in industrial, wireless/wireline, and defense applications.

Built on the Cyclone V device family architecture, this device combines a high count of logic elements with substantial embedded RAM and a broad I/O complement to address demanding control, signal processing, and interface tasks while operating across a wide temperature range.

Key Features

• Logic Capacity  149,500 logic elements for implementing large combinational and sequential logic designs.
• Embedded Memory  Approximately 7.88 Mbits of on-chip RAM (7,880,704 total RAM bits) to store data, buffers, and LUT-driven memories directly on the FPGA fabric.
• I/O Density  240 general-purpose I/Os provide broad external connectivity for sensors, peripherals, and high-pin-count interfaces.
• Core Voltage  Operates from 1.07 V to 1.13 V, matching low-voltage system designs and the Cyclone V family core requirements.
• Package and Mounting  484-LFBGA (supplier package 484-MBGA, 15×15) surface-mount package suited for compact, board-level integration.
• Industrial Temperature Range  Rated for −40 °C to 100 °C operation to support industrial and ruggedized deployments.
• Standards Compliance  RoHS-compliant construction for regulatory and environmental alignment.

Typical Applications

• Industrial Automation  High logic density and abundant on-chip RAM enable complex control algorithms, real-time signal processing, and multi-axis motor control in factory and process automation.
• Wireless and Wireline Infrastructure  Use the device’s sizable logic and memory resources for protocol processing, packet handling, and custom front-end logic in communication equipment.
• Defense and Aerospace Systems  Industrial temperature rating and surface-mount packaging make this FPGA suitable for ruggedized electronics requiring extended thermal performance.
• High-Density Interface Bridging  240 I/Os and large logic resources support protocol bridging, custom interface engines, and board-level glue logic.

Unique Advantages

• Large Fabric Capacity:  149,500 logic elements provide the headroom to consolidate multiple functions into a single FPGA, reducing board complexity.
• Substantial On-Chip Memory:  Approximately 7.88 Mbits of embedded RAM minimizes external memory dependence for buffering and local data storage.
• Broad I/O Count:  240 I/Os give flexible routing to external devices and allow high interfacing capability without additional multiplexing hardware.
• Industrial-Grade Operation:  −40 °C to 100 °C rating supports deployment in harsh thermal environments common to industrial and defense applications.
• Compact, Board-Ready Package:  The 484-LFBGA (15×15) surface-mount package enables high-density PCB designs while simplifying assembly.
• Regulatory Compliance:  RoHS compliance aligns the device with common environmental requirements for commercial and industrial products.

Why Choose 5CGXFC7B6M15I7?

As a Cyclone V GX family FPGA, the 5CGXFC7B6M15I7 combines large logic capacity, significant embedded memory, and a high I/O count in a compact, industrial-grade package—making it well suited for designers who need to integrate complex logic and buffering on a single device. Its specified core voltage range and extended operating temperature provide deterministic electrical and thermal characteristics for reliable system design.

This part is appropriate for engineering teams building industrial controllers, communications equipment, and other systems that demand substantial programmable logic, local memory, and robust board-level integration while maintaining RoHS compliance.

Request a quote or submit an RFQ today to check pricing and availability for part 5CGXFC7B6M15I7.