5CGXFC7B6M15C6N
| Part Description |
Cyclone® V GX Field Programmable Gate Array (FPGA) IC 240 7880704 149500 484-LFBGA |
|---|---|
| Quantity | 515 Available (as of May 5, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 9 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 484-MBGA (15x15) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 484-LFBGA | Number of I/O | 240 | Voltage | 1.07 V - 1.13 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 56480 | Number of Logic Elements/Cells | 149500 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 7880704 |
Overview of 5CGXFC7B6M15C6N – Cyclone V GX FPGA 484-LFBGA
The 5CGXFC7B6M15C6N is a Cyclone® V GX field programmable gate array (FPGA) in a 484-LFBGA package designed for cost- and power-sensitive applications that require integrated high-speed I/O and embedded memory. Built on the Cyclone V family architecture, this device combines FPGA fabric with features such as hard memory controllers and integrated transceivers to address industrial, wireless and wireline, and military applications.
With a core voltage window of 1.07 V to 1.13 V and commercial-grade qualification, the device targets designers needing substantial logic capacity, on-chip memory, and a compact surface-mount package for space-constrained boards.
Key Features
- Logic Capacity — 149,500 logic elements providing significant implementation resources for complex logic and control functions.
- Embedded Memory — Approximately 7.88 Mbits of total on-chip RAM, supported by M10K memory blocks with soft error correction code (ECC) as described for the Cyclone V family.
- High-speed I/O and Transceivers — 240 general-purpose I/O pins and integrated transceiver capability in the Cyclone V family, including supported line rates of 3.125 Gbps and 6.144 Gbps in the device family.
- DSP and ALM Architecture — Variable-precision DSP blocks and enhanced 8-input adaptive logic modules (ALMs) as part of the Cyclone V device architecture for efficient signal processing and logic packing.
- SoC Integration — Cyclone V family supports a Hard Processor System (HPS) option with an integrated dual-core Arm Cortex-A9 MPCore processor for tightly integrated processor+FPGA solutions (family-level feature).
- Power and Process — Built on TSMC 28-nm low-power (28LP) process technology with a nominal 1.1 V core characteristic at the family level; specified operating supply 1.07 V to 1.13 V for this part.
- Package and Mounting — 484-LFBGA package (supplier package 484-MBGA, 15 × 15 mm) intended for surface-mount assembly.
- Operating Conditions and Compliance — Commercial-grade device with an operating temperature range of 0 °C to 85 °C and RoHS compliance.
Typical Applications
- Wireless and Wireline Infrastructure — Use the device’s integrated transceivers and high I/O count to implement protocol handling, line-side interfaces, and custom packet processing.
- Industrial Systems and Control — Apply the FPGA fabric and embedded memory to implement motor control, sensor aggregation, and real-time control logic in industrial applications.
- Military and Defense Electronics — Suitable for mission-critical processing blocks, protocol bridging, and custom digital signal processing where field programmability is required.
- Embedded SoC Designs — Leverage Cyclone V family SoC features (HPS with dual-core Cortex-A9) for designs that combine processor tasks with FPGA-accelerated datapaths.
- High-Speed Host and Memory Interfaces — Implement PCIe Gen1/Gen2 host interfaces and external memory controllers using the family’s hard IP to achieve reliable board-level connectivity.
Unique Advantages
- High Logic and Memory Integration: 149,500 logic elements and approximately 7.88 Mbits of embedded memory let you consolidate complex functions onto a single device.
- Family-Level Low-Power Technology: Cyclone V devices are built on TSMC 28-nm low-power process technology and the family targets lower power consumption compared to prior generations.
- Built-In High-Speed I/O: Integrated transceivers and a 240-pin I/O capability reduce external interface components and simplify high-bandwidth designs.
- SoC Flexibility: Family support for a Hard Processor System (dual-core Arm Cortex-A9) enables tight processor–FPGA integration for heterogeneous system designs.
- Compact, Surface-Mount Package: The 484-LFBGA (484-MBGA 15 × 15) package provides a balance of I/O density and board footprint for space-constrained applications.
- Commercial Availability and Compliance: Commercial-grade specification with RoHS compliance aligns with mainstream electronics manufacturing and supply chains.
Why Choose 5CGXFC7B6M15C6N?
The 5CGXFC7B6M15C6N delivers a combination of substantial logic resources, embedded memory, and Cyclone V family system-level features—such as integrated transceivers and hard memory/processor IP—suited to designs that require programmable hardware with significant I/O and on-chip storage. Its 484-LFBGA surface-mount package and commercial operating range make it a practical choice for compact, production-oriented boards.
This part is aimed at engineering teams creating solutions in wireless/wireline, industrial, and defense segments who need the flexibility of FPGA-based implementations with family-level low-power process technology and documented device features for integration and optimization.
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