5CGXFC5F6M11I7N

IC FPGA 129 I/O 301MBGA
Part Description

Cyclone® V GX Field Programmable Gate Array (FPGA) IC 129 5001216 77000 301-TFBGA

Quantity 417 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time16 Weeks
Datasheet

Specifications & Environmental

Device Package301-MBGA (11x11)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case301-TFBGANumber of I/O129Voltage1.07 V - 1.13 V
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs29080Number of Logic Elements/Cells77000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits5001216

Overview of 5CGXFC5F6M11I7N – Cyclone V GX FPGA, 77,000 logic elements, 301-TFBGA

The 5CGXFC5F6M11I7N is an Intel Cyclone® V GX field-programmable gate array (FPGA) in a 301-TFBGA package designed for cost- and power-sensitive embedded systems. As a member of the Cyclone V family, it benefits from the series architecture that combines programmable logic with enhanced hard IP to address industrial, wireless/wireline and military markets.

This device delivers 77,000 logic elements, approximately 5.0 Mbits of embedded memory and 129 general-purpose I/Os in a surface-mount 301-MBGA (11×11) footprint. It is specified for industrial operation and supports a core supply voltage window of 1.07 V to 1.13 V with an operating temperature range from −40 °C to 100 °C.

Key Features

  • Core Logic  77,000 logic elements (ALM-based) for mid-density FPGA designs requiring configurable logic and datapath flexibility.
  • Embedded Memory  Approximately 5.0 Mbits of on-chip RAM to support buffering, state storage, and local data processing.
  • I/O Capacity & Interfaces  129 general-purpose I/Os suitable for diverse peripheral connectivity and system interfacing.
  • Family-Level Integration  Part of the Cyclone V family, which includes integrated transceivers, hard memory controllers and optional hard processor system (HPS) features such as an Arm Cortex-A9 MPCore in some variants.
  • Power  Core operating supply specified from 1.07 V to 1.13 V, consistent with the Cyclone V 1.1 V core class for low-power operation.
  • Package & Mounting  301-TFBGA package (supplier package: 301-MBGA 11×11) designed for surface-mount assembly in compact board layouts.
  • Temperature & Grade  Industrial grade device rated for −40 °C to 100 °C operating temperature to meet demanding environmental conditions.
  • Process & Architecture (Cyclone V family)  Built on a 28-nm low-power class process with enhanced ALMs, variable-precision DSP blocks, and M10K embedded memory blocks (family characteristics).

Typical Applications

  • Industrial Automation  Deterministic logic and I/O capacity make this device suitable for motion control, PLC functions and factory-automation interfaces operating across industrial temperature ranges.
  • Wireless & Wireline Infrastructure  Cyclone V family integration (transceivers and memory controllers) supports baseband processing, fronthaul/transport logic and protocol handling in communications equipment.
  • Defense & Military Electronics  Industrial-grade temperature range and configurable logic allow implementation of custom signal processing, I/O aggregation and system control in rugged platforms.
  • Embedded SoC and Control  Use in embedded processing subsystems where programmable logic is paired with hard IP (family-level HPS options) to offload tasks and accelerate deterministic control functions.

Unique Advantages

  • Mid-Density Logic with Flexibility:  77,000 logic elements provide a balance between capacity and cost for a wide range of embedded designs.
  • On-Chip Memory for Local Data:  Approximately 5.0 Mbits of embedded RAM supports buffering and stateful logic without external memory in many use cases.
  • Generous I/O Count:  129 I/Os accommodate multiple peripherals, sensors and external interfaces, simplifying board-level routing and I/O management.
  • Industrial Temperature Rating:  Qualified for −40 °C to 100 °C operation to meet environmental demands in factory and fielded equipment.
  • Compact, Surface-Mount Package:  301-TFBGA (301-MBGA 11×11) enables high-density board layouts while retaining accessibility to the Cyclone V feature set.
  • Series-Level Integration:  Leverages Cyclone V family attributes such as low-power 28-nm process, enhanced ALMs, DSP resources and integrated IP blocks for system-level optimization.

Why Choose 5CGXFC5F6M11I7N?

This Cyclone V GX device targets designers who need a cost- and power-conscious FPGA with substantial logic, embedded memory and I/O resources in an industrial-grade package. Its combination of 77,000 logic elements, approximately 5.0 Mbits of embedded memory, and 129 I/Os provides a practical platform for mid-range embedded and communications designs.

Being part of the Cyclone V family means access to the family’s documented architecture and development resources, allowing scalable migration within the series and enabling integration of hard IP where applicable. The result is a compact, reliable building block for systems that require programmable logic with real-world temperature and power characteristics.

Request a quote or submit an inquiry to receive pricing and availability information for the 5CGXFC5F6M11I7N Cyclone V GX FPGA.

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