5SGSED6K3F40I3LG

The 5SGSED6K3F40I3LG is a Stratix® V GS Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It combines high logic density and substantial embedded memory with a large I/O count and a compact 1517-BBGA FCBGA package for surface-mount assembly.

Designed for designs that demand extensive on-chip resources and extended temperature operation, this device provides a combination of approximately 583,000 logic elements, roughly 46 Mbits of embedded memory, and up to 696 user I/Os while operating from a low core supply voltage.

Key Features

• Core Capacity  Approximately 583,000 logic elements and 220,000 LABs, enabling implementation of large, complex digital functions within a single device.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large buffers, FIFOs, and local storage for high-throughput designs.
• I/O and Connectivity  Up to 696 user I/Os to support dense peripheral interfacing and high pin-count system designs.
• Power Supply  Core voltage supply range from 820 mV to 880 mV to match low-voltage FPGA core requirements.
• Package & Mounting  1517-BBGA (FCBGA) surface-mount package, supplier device package 1517-FBGA (40×40), suitable for compact PCB integration.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, aligned with industrial system requirements.
• Standards Compliance  RoHS compliant to support regulatory and environmental requirements.
• Series-Level Transceiver Options  As documented in the Stratix V device family datasheet, the family includes GX/GS/GT transceiver speed grade options for multi-gigabit channel support (refer to the Stratix V device documentation for series-level transceiver details).

Typical Applications

• I/O-Intensive Systems  High pin-count designs that require broad parallel or multiplexed interfacing can leverage the device’s 696 I/Os for flexible connectivity.
• High-Density Logic Integration  Complex digital processing tasks and algorithm implementations benefit from the device’s ~583,000 logic elements and substantial embedded RAM.
• Industrial Control and Automation  Industrial-grade temperature range (−40 °C to 100 °C) and RoHS compliance make this part suitable for deployed industrial applications requiring environmental robustness.

Unique Advantages

• High on-chip resource density: The combination of ~583k logic elements and ~46 Mbits of embedded memory reduces reliance on external logic and memory, simplifying system BOMs.
• Extensive I/O capability: Up to 696 I/Os supports broad peripheral and sensor interfaces without additional I/O expanders.
• Industrial temperature capability: Rated from −40 °C to 100 °C to withstand extended temperature ranges typical in industrial deployments.
• Compact, surface-mount package: The 1517-FBGA (40×40) FCBGA package enables high-density PCB layouts while maintaining a high pin count.
• Low-voltage core operation: Core supply range of 820–880 mV enables integration into modern low-voltage power architectures.
• Regulatory readiness: RoHS compliance supports environmental and regulatory requirements for commercial and industrial products.

Why Choose 5SGSED6K3F40I3LG?

The 5SGSED6K3F40I3LG delivers a balanced mix of high logic and memory density, extensive I/O, and industrial temperature capability in a compact FCBGA package. It is positioned for system designs that require significant on-chip resources and reliable operation across a wide temperature range.

Engineers and procurement teams targeting scalable, resource-rich FPGA solutions will find this Stratix V GS device appropriate for complex processing, I/O-heavy implementations, and industrial applications where on-board integration and environmental resilience are priorities. Refer to the Stratix V device documentation for series-level transceiver and speed-grade details when planning multi-gigabit serial interfaces.

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