5SGSED6K3F40I3N

The 5SGSED6K3F40I3N is a Stratix V GS Field Programmable Gate Array (FPGA) IC in an industrial temperature grade. It delivers high logic density and extensive I/O capability in a 1517-BBGA FCBGA package, supporting designs that require large on-chip memory, significant routing resources, and broad board-level connectivity.

Designed for applications operating across an industrial temperature range, this device combines high logic element count, approximately 46 Mbits of embedded memory, and a low-voltage core supply to address complex digital integration needs.

Key Features

• High Logic Density  Provides 583,000 logic elements to implement large-scale logic, control, and datapath architectures.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, lookup tables, and large local storage requirements.
• Extensive I/O  Up to 696 I/O pins for broad peripheral and board-level interfacing needs.
• Industrial Temperature Grade  Specified for operation from −40 °C to 100 °C for reliable performance in industrial environments.
• Low-Voltage Core  Core supply range of 820 mV to 880 mV to match low-voltage system power domains.
• Package and Mounting  1517-BBGA (FCBGA) package, supplier device package 1517-FBGA (40×40), designed for surface-mount assembly.
• Regulatory Compliance  RoHS compliant to meet environmental lead-free requirements.

Typical Applications

• Industrial Control & Automation  Industrial temperature rating and extensive I/O make the device suitable for complex control systems and sensor interface networks.
• Communications & Infrastructure  High logic density and large embedded memory support protocol processing, packet buffering, and system aggregation functions.
• High-Density System Integration  Large logic and memory resources enable consolidation of multiple functions into a single FPGA for compact, high-performance designs.

Unique Advantages

• Substantial On-Chip Resources: 583,000 logic elements and ~46 Mbits of embedded memory reduce the need for external logic and memory, simplifying system BOM.
• Broad Board Connectivity: 696 I/O pins provide flexibility for complex interconnect, enabling multiple interfaces and peripherals without external expander devices.
• Industrial Reliability: −40 °C to 100 °C operating range targets demanding environments where temperature resilience is required.
• Low-Voltage Core: 0.82–0.88 V supply compatibility supports integration into modern low-power system domains.
• Surface-Mount FCBGA Package: 1517-BBGA (40×40) package offers a compact, manufacturable footprint for high-density board designs.
• RoHS Compliant: Meets lead-free environmental requirements for commercial and industrial products.

Why Choose 5SGSED6K3F40I3N?

The 5SGSED6K3F40I3N positions itself as a high-density Stratix V GS FPGA option for industrial designs that require substantial logic resources, significant on-chip memory, and wide-ranging I/O. Its industrial temperature rating and low-voltage core operation make it suitable for demanding embedded systems and infrastructure equipment that consolidate multiple functions onto a single device.

For engineers targeting scalable, high-capacity FPGA integration with a compact FCBGA footprint, this device offers a clear combination of logic, memory, and connectivity to accelerate system-level consolidation and design efficiency.

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