5SGSED6K3F40I4N

The 5SGSED6K3F40I4N is a Stratix V GS field-programmable gate array (FPGA) in a 1517-BBGA (FCBGA) package offering high-density programmable logic and abundant on-chip memory. It is provided in an industrial grade with a specified operating temperature range of –40 °C to 100 °C and is RoHS compliant.

Key device characteristics include approximately 583 000 logic elements, approximately 46 Mbits of embedded memory, and 696 I/O pins, making the device suitable for complex digital designs that require large logic capacity and extensive I/O integration.

Key Features

• Core logic capacity  Approximately 583 000 logic elements to implement large, complex digital systems on a single FPGA.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM for buffering, data storage, and algorithm acceleration without reliance on external memory.
• I/O density  696 available I/O pins to support rich peripheral connectivity and multi‑lane interfacing.
• Power supply  Core voltage supply range specified at 820 mV to 880 mV for the device core power domain.
• Package and mounting  1517‑BBGA (FCBGA) package, supplier device package 1517‑FBGA (40×40); surface‑mount mounting type for board-level integration.
• Industrial temperature grade  Rated for operation from –40 °C to 100 °C, suitable for demanding temperature environments.
• Series-level transceiver provisions  Part of the Stratix V GS family; the Stratix V device datasheet defines the available transceiver speed grades for the series.
• Environmental compliance  RoHS compliant.

Typical Applications

• High-density digital implementations  Use the device to consolidate large logic designs onto a single FPGA, leveraging the ~583k logic elements for complex control and processing logic.
• On-chip buffering and memory‑intensive functions  Approximately 46 Mbits of embedded RAM provides substantial local storage for packet buffers, frame buffers, and algorithm state.
• Multi‑interface systems  With 696 I/Os, the device supports designs that require many external interfaces or parallel data lanes without extensive glue logic.

Unique Advantages

• High integration density: The large logic element count reduces the need for multiple FPGAs or external glue logic, simplifying system design and board space.
• Significant on‑chip memory: Approximately 46 Mbits of embedded RAM lowers external memory dependency and can improve system latency and throughput for data‑intensive tasks.
• Extensive connectivity: 696 I/Os enable direct interfacing to a wide range of peripherals and multiple parallel interfaces, reducing BOM complexity.
• Industrial robustness: Rated for –40 °C to 100 °C operation to meet harsher environmental requirements.
• FCBGA packaging: 1517‑BBGA (1517‑FBGA, 40×40) surface‑mount package supports high pin count and compact board layouts.
• Regulatory compliance: RoHS‑compliant construction supports environmentally conscious designs.

Why Choose 5SGSED6K3F40I4N?

The 5SGSED6K3F40I4N positions itself as a high‑capacity, industrial‑grade Stratix V GS FPGA that brings together substantial logic resources, large on‑chip RAM, and a high I/O count in a compact FCBGA package. These characteristics make it well suited for engineers who need to integrate complex digital functions, significant buffering or memory, and extensive peripheral connectivity within a single device.

Choosing this device provides a scalable FPGA platform with clear operational specifications (core voltage range, operating temperature, package) and series‑level support for transceiver options as defined in the Stratix V datasheet, enabling predictable system integration and long‑term design planning.

Request a quote or submit an RFQ for 5SGSED6K3F40I4N to receive pricing and availability information for your next design.