5SGSED6K3F40I3NCV
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 696 46080000 583000 1517-BBGA, FCBGA |
|---|---|
| Quantity | 1,108 Available (as of May 6, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | RFQ |
| Datasheet |
Specifications & Environmental
| Device Package | 1517-FBGA (40x40) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1517-BBGA, FCBGA | Number of I/O | 696 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | OBSOLETE | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6K3F40I3NCV – Stratix® V GS FPGA, 1517-BBGA (FCBGA)
The 5SGSED6K3F40I3NCV is a Stratix® V GS Field Programmable Gate Array (FPGA) IC in a 1517-BBGA (FCBGA) package. It provides a large programmable fabric and on-chip memory suitable for complex, high-density digital designs.
Designed for industrial-grade applications, this device combines high logic capacity, extensive I/O, and low core-voltage operation to support demanding embedded and system-level implementations.
Key Features
- Logic Capacity Approximately 583,000 logic elements, enabling implementation of large, complex logic designs.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and data processing functions.
- I/O Density 696 I/O pins to support extensive system interfacing and parallel connectivity.
- Power Supply Core voltage specified from 820 mV to 880 mV for low-voltage FPGA core operation.
- Package & Mounting 1517-BBGA (FCBGA) supplier package 1517-FBGA (40×40); surface-mount mounting type for standard PCB assembly.
- Industrial Temperature Grade Rated for operation from –40°C to 100°C to meet industrial environmental requirements.
- RoHS Compliant Manufactured to meet RoHS environmental compliance.
Typical Applications
- High-density logic designs Use the large logic element count and embedded memory for complex FPGA implementations and custom processing pipelines.
- High-pin-count interfacing Leverage 696 I/O pins for complex peripheral integration, multi-channel data acquisition, and parallel bus systems.
- Industrial systems Industrial temperature rating (–40°C to 100°C) makes this device suitable for embedded control and instrumentation in industrial environments.
- Low-voltage core architectures Core voltage range of 820 mV to 880 mV fits designs that require low-voltage FPGA operation and power-managed systems.
Unique Advantages
- Massive programmable fabric: The device’s ~583k logic elements support large-scale logic integration, reducing the need for multi-device partitioning.
- Substantial on-chip memory: Approximately 46 Mbits of embedded RAM provides local storage for buffering, state machines, and data processing without external memory dependency.
- Extensive I/O capability: 696 I/O pins enable broad external connectivity, simplifying system-level routing and peripheral expansion.
- Industrial temperature range: Rated operation from –40°C to 100°C supports deployment in thermally demanding and industrial settings.
- Surface-mount, high-density package: 1517-BBGA (FCBGA) package with a 40×40 supplier footprint supports compact board layouts and standard SMT assembly.
- Regulatory readiness: RoHS compliance aligns with common environmental requirements for electronic assemblies.
Why Choose 5SGSED6K3F40I3NCV?
The 5SGSED6K3F40I3NCV positions itself as a high-capacity, industrial-grade FPGA option within the Stratix® V GS family. Its combination of approximately 583,000 logic elements, roughly 46 Mbits of embedded RAM, and 696 I/Os makes it well suited for large, system-level FPGA implementations that require significant on-chip resources and broad external connectivity.
With a surface-mount 1517-BBGA package, low core-voltage operation, and –40°C to 100°C rating, this device addresses designs that demand high integration density, robust thermal tolerance, and compliance with common environmental standards.
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