5SGSED6N1F45C2G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,331 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N1F45C2G – Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

The 5SGSED6N1F45C2G is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA FCBGA package. It provides a large programmable fabric with a high I/O count and substantial on-chip memory for complex logic integration at the board level.

Key attributes include approximately 583,000 logic elements, approximately 46 Mbits of embedded memory, 840 I/Os, and a core supply voltage range of 870 mV to 930 mV. The device is offered in a commercial temperature grade with an operating range of 0 °C to 85 °C and is RoHS compliant.

Key Features

  • Logic Density  Approximately 583,000 logic elements for implementing complex programmable logic and custom datapaths.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and memory-intensive functions without external memory.
  • High I/O Count  840 I/O pins to support wide parallel buses, multiple interfaces, and high-pin-count system integration.
  • Power Supply  Core voltage supply range of 870 mV to 930 mV to match system power rails and enable predictable core operation.
  • Package and Mounting  1932-BBGA (FCBGA) package; supplier package listed as 1932-FBGA, FC (45×45). Surface-mount device suitable for board-level assembly.
  • Temperature Grade  Commercial grade with an operating temperature range of 0 °C to 85 °C for standard commercial applications.
  • Environmental Compliance  RoHS compliant to support regulatory and manufacturing requirements.

Typical Applications

  • System Prototyping and Validation  Use the large logic element count and extensive I/O to prototype complex digital systems and validate hardware architectures on a single device.
  • Embedded Acceleration  Leverage abundant on-chip RAM and programmable logic to implement hardware accelerators, data buffering, and custom compute blocks.
  • High-Density I/O Control  Ideal for designs that require many external interfaces or wide parallel connections, using the 840 available I/Os for sensors, peripherals, or data buses.
  • Communications and Protocol Bridging  Implement protocol translation and interface aggregation where substantial logic resources and memory are needed to manage data flows.

Unique Advantages

  • Large Programmable Fabric:  Approximately 583,000 logic elements enable integration of complex state machines, datapaths, and control logic on a single device.
  • Substantial On-Chip Memory:  Approximately 46 Mbits of embedded RAM reduces dependence on external memory components and simplifies board design.
  • Extensive I/O Capacity:  840 I/Os provide the flexibility to connect multiple interfaces without external multiplexing hardware.
  • Commercial Temperature Operation:  Rated for 0 °C to 85 °C, suitable for standard commercial product environments and development platforms.
  • RoHS Compliant:  Meets environmental compliance requirements for lead-free manufacturing and global distribution.
  • Compact FCBGA Packaging:  1932-BBGA (1932-FBGA, FC 45×45) package supports high-pin-count integration in a surface-mount form factor.

Why Choose 5SGSED6N1F45C2G?

The 5SGSED6N1F45C2G Stratix V GS FPGA combines a high logic element count, significant embedded memory, and a very large I/O complement in a single commercial-grade FCBGA package. These characteristics make it well suited for designers who need to consolidate complex logic, manage wide data paths, and minimize external component count at the board level.

For teams focused on scalable, programmable designs where on-chip resources and I/O density drive system architecture, this Stratix V GS device delivers predictable electrical operating parameters and compliance details required for commercial deployments.

Request a quote or submit an inquiry to receive pricing, availability, and ordering information for the 5SGSED6N1F45C2G.

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