5SGSED6N1F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 190 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N1F45C2LN – Stratix® V GS FPGA, 1932-BBGA (45×45), Commercial

The 5SGSED6N1F45C2LN is a Stratix® V GS field-programmable gate array (FPGA) from Intel, built on a 28-nm technology platform. This GS-class device combines a high logic element count with abundant DSP resources and integrated transceivers, making it suitable for transceiver‑based, DSP‑centric applications in wireline, broadcast, military, and high-performance computing markets.

Designed for high-performance, data‑intensive designs, the device integrates large on‑chip RAM, variable‑precision DSP blocks and a broad I/O fabric to support systems that require significant algorithmic processing alongside high‑speed serial interfaces.

Key Features

  • Core and Fabric  28-nm Stratix V architecture with approximately 583,000 logic elements, delivering a large programmable fabric for complex designs.
  • Memory  Approximately 46 Mbits of embedded memory (total RAM bits: 46,080,000) organized in M20K blocks for high‑capacity, low‑latency storage on chip.
  • DSP and Transceivers  Abundant variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers, plus integrated transceivers with 14.1‑Gbps data‑rate capability for DSP‑centric, serial‑link applications.
  • I/O and Package  Up to 840 I/Os in a 1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface‑mount mounting type simplifies PCB assembly for compact systems.
  • Power and Temperature  Core supply range of 820 mV to 880 mV and commercial operating temperature range of 0 °C to 85 °C, suitable for standard commercial applications.
  • System Integration  Features such as fractional PLLs and the Embedded HardCopy Block for hardening IP (including PCIe Gen3/Gen2/Gen1) support tighter integration and migration to HardCopy ASICs for production volume.
  • Compliance  RoHS‑compliant for environmental regulatory alignment.

Typical Applications

  • Wireline and Packet Processing  Use the device’s DSP blocks and high I/O count for packet processing, traffic management and other wireline functions that require heavy signal processing.
  • Broadcast and Media Processing  High‑precision DSP resources and on‑chip memory support video/multimedia algorithms, transcoding and real‑time signal chains.
  • High‑Performance Computing (HPC)  Leverage the large logic array and dense DSP multiplier resources for algorithm acceleration and computation‑heavy tasks.
  • Military and Communications Systems  Integrated transceivers and flexible fabric make the device suitable for transceiver‑based communications and sensor processing applications in commercial defense‑adjacent systems.

Unique Advantages

  • High logic capacity: Approximately 583,000 logic elements provide the headroom to implement large, complex designs without immediate migration to multiple devices.
  • Substantial on‑chip memory: Roughly 46 Mbits of embedded RAM reduce external memory dependence and improve bandwidth and latency for buffering and state storage.
  • Extensive DSP resources: Support for thousands of 18×18 or 27×27 multipliers enables efficient implementation of filters, transforms and other math‑intensive kernels.
  • Integrated high‑speed transceivers: 14.1‑Gbps transceiver capability simplifies system routing for serial links and backplane/optical interfaces.
  • Flexible I/O and packaging: 840 I/Os in a 1932‑FBGA (45×45) surface‑mount package provides high pin density for complex board designs.
  • Production migration path: The Embedded HardCopy Block and Stratix V family support a low‑risk transition from FPGA prototyping to HardCopy V ASICs for higher‑volume production.

Why Choose 5SGSED6N1F45C2LN?

The 5SGSED6N1F45C2LN positions itself as a commercial‑grade, DSP‑focused Stratix V GS FPGA that balances a large programmable fabric, significant embedded memory and dense DSP multipliers with integrated transceiver capability. This combination targets designs that require high algorithmic throughput alongside robust serial connectivity.

For teams building transceiver‑based signal processing, networking, broadcast or compute‑intensive systems, the device offers a platform that supports prototyping and a clear migration path to HardCopy ASICs for production scaling, while providing the component-level specifications needed for procurement and system integration.

Request a quote or submit an inquiry to obtain pricing and availability for 5SGSED6N1F45C2LN.

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