5SGSED6N1F45I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,166 Available (as of October 7, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6N1F45I2G – Stratix® V GS FPGA, 583,000 logic elements, 840 I/Os
The 5SGSED6N1F45I2G is a Stratix® V GS field programmable gate array (FPGA) offered in a high‑pin-count FCBGA package. It provides substantial on‑chip logic and memory resources along with a large I/O complement, suited for industrial‑grade designs that require dense integration and robust operating range.
This device targets designs that demand high logic capacity, abundant embedded memory, and extensive I/O connectivity, while operating across an industrial temperature range and a low‑voltage core supply.
Key Features
- Core Logic 583,000 logic elements for high-density implementation of complex digital functions.
- Embedded Memory Approximately 46.08 Mbits of on‑chip RAM to support large buffers, FIFOs, and memory‑intensive algorithms.
- I/O Capacity 840 user I/Os to accommodate wide parallel interfaces, multi‑lane buses, and extensive peripheral connectivity.
- Power Core voltage supply range of 870 mV to 930 mV to match low‑voltage system architectures.
- Package & Mounting 1932‑BBGA (FCBGA) package, supplier device package listed as 1932‑FBGA, FC (45×45), designed for surface‑mount applications.
- Operating Environment Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
- Compliance RoHS compliant.
Typical Applications
- High‑density logic systems Implement large custom processing, protocol handling, or control logic using the device's extensive logic element count and embedded memory.
- Industrial communications Use the large I/O complement and on‑chip resources for industrial networking, protocol bridging, and control interfaces within the specified temperature range.
- Data buffering and packet processing Leverage approximately 46.08 Mbits of embedded RAM for packet buffering, FIFO management, and memory‑intensive data flows.
Unique Advantages
- Large programmable fabric: 583,000 logic elements enable implementation of complex, high‑function designs without external ASICs.
- Significant on‑chip memory: Approximately 46.08 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage tasks.
- Extensive I/O connectivity: 840 I/Os simplify board design by accommodating multiple parallel interfaces and peripherals directly on the device.
- Industrial operating range: Rated from −40 °C to 100 °C for reliable operation in temperature‑challenging deployments.
- Low‑voltage core operation: 0.87–0.93 V core supply aligns with modern low‑voltage system domains to help manage power profiles.
- High‑density FCBGA package: 1932‑ball FCBGA (45×45) provides a compact footprint for high‑pin‑count designs while supporting surface‑mount assembly.
Why Choose 5SGSED6N1F45I2G?
The 5SGSED6N1F45I2G combines a large logic fabric, substantial embedded memory, and a very high I/O count in an industrial‑rated FCBGA package. These attributes make it well suited for engineers building high‑integration systems that require on‑device capacity for logic, buffering, and extensive interfacing while maintaining operation across a wide temperature range.
For design teams focused on scaling functionality without adding external components, this Stratix® V GS device offers a balanced mix of resources and packaging for medium‑to‑high complexity applications where integration, reliability, and supply voltage compatibility matter.
If you would like a quote or additional purchasing information for 5SGSED6N1F45I2G, submit a request or inquiry today to receive pricing and availability details.

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