5SGSED6N1F45I2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 35 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N1F45I2N – Stratix® V GS FPGA, 583,000 logic elements, 840 I/Os, 1932-BBGA

The 5SGSED6N1F45I2N is an Intel Stratix V GS field-programmable gate array (FPGA) implemented in a 28‑nm process and delivered in a 1932‑BBGA (FCBGA) package. As a GS‑variant Stratix V device, it targets transceiver‑based, DSP‑centric applications with a balance of large logic capacity, abundant I/O, and on‑chip memory.

Key value propositions include high logic and memory resources for data‑intensive designs, integrated DSP capabilities and transceivers (family features), and an industrial operating temperature range suitable for demanding environments.

Key Features

  • Process and Architecture  28‑nm Stratix V family architecture with adaptive logic modules (ALMs) and a comprehensive fabric clocking and routing network (family feature documented in the Stratix V device overview).
  • Logic Capacity  583,000 logic elements to implement large, complex FPGA designs.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM (46,080,000 bits) to support buffering, packet processing, and local storage.
  • DSP and Transceiver Capability (Family Features)  GS‑variant devices provide abundant variable‑precision DSP blocks (family documentation cites support up to 3,926 18×18 or 1,963 27×27 multipliers) and integrated transceivers for high‑speed serial interfaces.
  • I/O Count  840 user I/Os for wide external interfacing and high pin‑count system integration.
  • Power  Core voltage specification: 870 mV to 930 mV, enabling compatibility with the Stratix V core power domain.
  • Package & Mounting  1932‑BBGA (FCBGA) package; supplier device package listed as 1932‑FBGA, FC (45×45). Surface‑mount device.
  • Environmental & Temperature  Industrial grade with an operating range of −40 °C to 100 °C. RoHS compliant.
  • Embedded Hard IP (Family Feature)  Supports Embedded HardCopy Block for hardened IP instantiation such as PCIe Gen1/Gen2/Gen3 (family documentation).

Typical Applications

  • High‑performance DSP systems  Deploy variable‑precision DSP blocks and large logic arrays for compute‑intensive signal processing and algorithm acceleration.
  • Transceiver‑based communications  Use the GS family’s integrated transceivers and high I/O count for backplane, optical interfaces, and wireline transport applications.
  • Network and packet processing  Leverage abundant on‑chip memory and logic to implement buffering, traffic management, and protocol handling.
  • Broadcast and military communications  Industrial temperature rating and family features make the device suitable for deployment in broadcast and defense communication systems.
  • High‑performance computing  Integrate large‑scale logic, DSP resources, and hardened IP blocks for accelerator and compute‑centric designs.

Unique Advantages

  • Large logic fabric: 583,000 logic elements provide headroom for complex, multi‑function designs.
  • Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM reduces external memory dependence and simplifies board design.
  • High I/O density: 840 I/Os enable broad connectivity and high‑pin‑count interconnects.
  • DSP‑centric architecture: GS family DSP block counts and multiplier configurations support variable‑precision signal processing workloads.
  • Industrial‑grade operation: Specified −40 °C to 100 °C operating range for deployment in demanding environments.
  • Compact, high‑density package: 1932‑BBGA (FCBGA) in a 1932‑FBGA supplier package (45×45) supports dense routing for complex boards.

Why Choose 5SGSED6N1F45I2N?

The 5SGSED6N1F45I2N brings substantial logic, memory, I/O and family‑level DSP/transceiver features together in an industrial‑rated Stratix V GS FPGA. It is positioned for engineers building transceiver‑based, DSP‑heavy systems where on‑chip resources and robust operating range matter.

For designs that require scalable performance, integrated hard IP options, and compatibility with the Stratix V device family capabilities, this device provides a clear platform for development and deployment in data‑intensive and communications applications.

Request a quote or submit an inquiry to discuss availability, lead times, and volume pricing for 5SGSED6N1F45I2N.

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