5SGSED6N2F45C2G

The 5SGSED6N2F45C2G is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, provided in a 1932-BBGA (FCBGA) package. It delivers a large logic capacity and substantial on-chip RAM while supporting a high count of general-purpose I/O, making it suitable for complex, high-density FPGA designs.

Built for commercial-grade applications, this device combines 583,000 logic elements with approximately 46 Mbits of embedded memory and 840 I/Os. The device operates from a low-voltage core supply (870 mV to 930 mV) and is rated for surface-mount assembly with an operating temperature range of 0 °C to 85 °C.

Key Features

• Logic Capacity  Provides 583,000 logic elements for implementing large-scale digital designs and deep datapath logic.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, large lookup tables, and state storage without external memory.
• High I/O Count  840 I/O pins to enable broad peripheral connectivity and dense board-level integration for complex systems.
• Power and Core Voltage  Core supply range of 870 mV to 930 mV to support low-voltage operation and power-optimized system designs.
• Package and Mounting  1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC 45×45) designed for surface-mount assembly.
• Commercial Temperature Grade  Rated for operation from 0 °C to 85 °C for commercial applications.
• RoHS Compliant  Environmentally compliant manufacturing and materials.
• Manufacturer  Intel (Stratix V family)—series-level documentation and device datasheet available for electrical and timing characteristics.

Typical Applications

• High-density digital systems  Leverage the 583,000 logic elements and extensive I/O to implement large custom logic blocks and multi-function controllers on a single FPGA.
• On-chip buffering and memory-intensive logic  Approximately 46 Mbits of embedded RAM enables local high-bandwidth buffering and state storage without immediate reliance on external memories.
• Multi-interface aggregation  With 840 I/Os, integrate numerous serial and parallel peripherals, sensors, and control interfaces for system consolidation.

Unique Advantages

• Substantial logic resources: 583,000 logic elements allow implementation of large, complex designs without partitioning across multiple devices.
• Significant embedded memory: Approximately 46 Mbits of on-chip RAM reduces external memory requirements and simplifies board-level design.
• Wide I/O capacity: 840 I/Os provide flexibility for dense connectivity, multi-channel interfaces, and extensive peripheral support.
• Compact system footprint: 1932-BBGA FCBGA packaging supports high pin density while maintaining a manageable board area for advanced designs.
• Commercial temperature suitability: Rated 0 °C to 85 °C for standard commercial deployments where this temperature range aligns with system requirements.
• RoHS compliance: Meets environmental manufacturing requirements for many commercial applications.

Why Choose 5SGSED6N2F45C2G?

The 5SGSED6N2F45C2G balances large-scale programmable logic, plentiful on-chip memory, and extensive I/O in a single commercial-grade Stratix V GS FPGA package. Its low-voltage core operation and dense FCBGA footprint make it a solid choice for engineers designing complex digital systems that require consolidation, high I/O count, and significant embedded memory.

This device is well suited to teams and projects that require scalable logic capacity with the backing of Intel’s Stratix V device documentation and ecosystem. Its combination of resources supports longer-term design scalability and integration while aligning with commercial temperature and RoHS requirements.

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