5SGSED6N2F45C2N

The 5SGSED6N2F45C2N is a Stratix V GS Field Programmable Gate Array (FPGA) supplied in a 1932-BBGA (FCBGA) package. It is built on a 28-nm process and targets high-throughput, DSP-centric designs that require abundant logic, embedded memory, and on-chip transceiver support.

Engineered for commercial-grade applications, this device combines a large logic fabric and substantial embedded RAM with integrated transceiver and DSP resources to address data-intensive tasks such as packet processing, signal processing, and high-bandwidth interfaces.

Key Features

• Process & core architecture – Based on 28-nm TSMC technology with adaptive logic modules (ALMs) and a comprehensive fabric clocking network as described for the Stratix V family.
• Logic capacity – Approximately 583,000 logic elements, providing significant programmable capacity for complex FPGA designs.
• Embedded memory – Approximately 46 Mbits of on-chip RAM (total RAM bits: 46,080,000), implemented in M20K block architecture.
• DSP resources – Variable-precision DSP blocks; Stratix V GS devices support up to 3,926 18×18 or 1,963 27×27 multipliers for high-performance signal processing.
• Transceivers – Integrated transceivers with up to 14.1 Gbps data-rate capability on GS devices, suitable for backplane and optical interface applications.
• I/O density – 840 device I/Os to support wide parallel interfaces and high-density board-level connectivity.
• Package & mounting – 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount device.
• Power – Core voltage supply specified from 870 mV to 930 mV.
• Operating range – Commercial temperature grade, specified for 0 °C to 85 °C.
• System-level IP – Family-level support for Embedded HardCopy blocks, fractional PLLs, and hardened PCIe instantiation options described in Stratix V documentation.
• Environmental compliance – RoHS compliant.

Typical Applications

• High-performance DSP systems – Leverage the large pool of variable-precision DSP multipliers for applications such as broadcast processing, software-defined radio, and signal conditioning.
• Optical and backplane interfaces – Integrated transceivers with multi-gigabit capability enable backplane and optical line-card designs used in networking and telecommunications.
• Packet processing and network appliances – High logic density and abundant I/O support complex packet engines, traffic management, and protocol offload functions.
• High-bandwidth compute and test equipment – Combines large embedded memory and logic resources for data buffering, pattern generation, and high-throughput test instrumentation.

Unique Advantages

• Substantial programmable capacity: Approximately 583,000 logic elements allow large designs to be implemented without external logic expansion.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependency on off-chip memory and improves data-path latency.
• DSP-centric architecture: Extensive variable-precision DSP multipliers provide flexibility and performance for multiply-accumulate intensive workloads.
• High I/O and transceiver integration: 840 I/Os and integrated 14.1-Gbps transceivers enable high-bandwidth interfaces and dense system integration.
• Compact, board-friendly package: 1932-BBGA/1932-FBGA (45×45) FCBGA package supports surface-mount assembly in space-constrained systems.
• Commercial thermal profile with RoHS compliance: Rated 0 °C to 85 °C and RoHS compliant for standard commercial deployments.

Why Choose 5SGSED6N2F45C2N?

The 5SGSED6N2F45C2N positions itself where high logic capacity, substantial embedded memory, and DSP/transceiver integration are required in commercial-grade systems. Its combination of approximately 583,000 logic elements, roughly 46 Mbits of on-chip RAM, and GS-class DSP/transceiver resources makes it suitable for data-intensive signal processing, network, and test applications.

Designed within the Stratix V family architecture, the device offers a known FPGA fabric and system-level hard IP capabilities that support prototyping and production deployments. For engineering teams targeting high-throughput, DSP-focused designs that require dense I/O and multi-gigabit interfaces, this FPGA provides a balanced platform of performance and integration.

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