5SGSED6N2F45I2L

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,209 Available (as of May 4, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N2F45I2L – Stratix® V GS FPGA, 583,000 logic elements, 1932-BBGA (FCBGA)

The 5SGSED6N2F45I2L is an Intel Stratix V GS field-programmable gate array (FPGA) packaged in a 1932-ball FCBGA. It is built on the Stratix V family architecture and is targeted at transceiver-centric, DSP-intensive designs that require substantial programmable logic, embedded memory, and I/O density.

This device is suitable for applications such as wireline and optical communications, broadcast, military, and high-performance computing where a combination of high logic capacity, abundant DSP resources, and integrated transceivers are required.

Key Features

  • Core architecture – Stratix V family architecture with redesigned adaptive logic modules and a multi-track routing fabric for complex logic implementation.
  • Logic capacity – 583,000 logic elements to implement large, high-density designs.
  • Embedded memory – Approximately 46 Mbits of on-chip RAM provided via M20K memory blocks for buffering, packet storage, and intermediate data.
  • DSP resources – Variable-precision DSP blocks with support in the Stratix V GS family for up to 3,926 18×18 or 1,963 27×27 multipliers for high-throughput signal processing.
  • Transceivers and I/O – Transceiver capability in the Stratix V GS family with 14.1‑Gbps class links and 840 device I/Os to support high-bandwidth serial and parallel interfaces.
  • Power and core voltage – Core supply voltage range of 820 mV to 880 mV for defined power delivery and thermal planning.
  • Package and mounting – 1932-BBGA (FCBGA) / supplier package 1932-FBGA, FC (45×45), surface-mount footprint for dense board-level integration.
  • Operating environment – Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Regulatory – RoHS compliant.

Typical Applications

  • High-performance DSP and HPC – Use the abundant DSP multipliers and large embedded RAM for signal processing, scientific acceleration, and compute offload tasks.
  • Optical and wireline communications – Integrated high-speed transceivers and high I/O count support backplane and optical interface implementations for 40G/100G systems.
  • Network infrastructure and packet processing – Large logic capacity and on-chip memory enable complex packet processing, traffic management, and protocol offload functions.
  • Broadcast and military systems – DSP-centric architectures and industrial temperature range address demanding signal processing roles in broadcast and defense applications.

Unique Advantages

  • High programmable density: 583,000 logic elements allow consolidation of multiple functions into a single FPGA, reducing system-level component count.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM supports deep buffering and high-throughput data paths without external memory.
  • Power-focused core voltage range: Defined 820 mV–880 mV core supply range supports predictable power budgeting for high-density designs.
  • Rich DSP capability: Variable-precision DSP blocks (up to the multipliers stated for Stratix V GS devices) enable precision-tuned signal processing implementations.
  • High-speed connectivity: Integrated transceiver capability and 840 I/Os provide the interface bandwidth needed for modern communication systems.
  • Industrial qualification and RoHS compliance: −40 °C to 100 °C operating range and RoHS compliance for deployment in industrial environments.

Why Choose 5SGSED6N2F45I2L?

The 5SGSED6N2F45I2L combines a high-density Stratix V GS FPGA fabric with extensive embedded memory, plentiful DSP resources, and broad I/O/transceiver capability to address DSP-centric, bandwidth-heavy designs. Its industrial temperature rating and RoHS compliance make it appropriate for demanding deployments that require reliable operation across temperature extremes.

This device is well suited for engineers and system designers building complex communications, signal processing, and compute-accelerator applications that need scalable logic capacity, integrated memory, and high-speed interfaces in a compact FCBGA package.

Request a quote or submit a product inquiry for part number 5SGSED6N2F45I2L to receive pricing and availability information.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up