5SGSED6N2F45I2NCV

The 5SGSED6N2F45I2NCV is a Stratix® V GS Field Programmable Gate Array (FPGA) from Intel, offered in a high-density 1932-BBGA (45×45) FCBGA package for surface-mount applications. It delivers large programmable logic capacity, extensive I/O, and significant on-chip memory for complex digital designs.

Designed for applications that require high logic capacity, broad I/O connectivity, and industrial temperature capability, this device is part of the Stratix V family documented in the device datasheet with industrial and commercial speed-grade options.

Key Features

• Core FPGA Architecture Stratix V GS family FPGA architecture provided by Intel, optimized for high-density programmable logic.
• Logic Capacity Approximately 583,000 logic elements to implement complex custom logic, state machines, and datapaths.
• Embedded Memory Approximately 46 Mbits of total on-chip RAM for buffering, packet processing, and local storage.
• High I/O Count 840 user I/O pins to support multi-port interfaces and dense board-level connectivity.
• Power Supply Core voltage range of 870 mV to 930 mV for the device core supply domain.
• Package & Mounting 1932-BBGA, FCBGA (1932-FBGA, FC 45×45) package in a surface-mount form factor suitable for high-density PCB designs.
• Industrial Temperature Grade Rated for operation from −40 °C to 100 °C, supporting deployment in industrial environments.
• Regulatory Compliance RoHS compliant, meeting common requirements for lead-free assembly.

Typical Applications

• High-density digital processing — Implement large custom datapaths, signal processing blocks, and complex control logic using the device's extensive logic elements and embedded memory.
• Multi-port interface hubs — Leverage 840 I/Os to aggregate and bridge multiple parallel interfaces or I/O-rich subsystems without excessive external multiplexing.
• Industrial control and automation — Industrial temperature rating and robust packaging make the device suitable for factory automation, motion control, and other industrial electronics.
• Prototyping and system integration — High logic and memory resources support system-level prototypes and integration of IP blocks for advanced hardware validation.

Unique Advantages

• Massive logic density: Approximately 583k logic elements enable highly integrated custom logic designs and complex stateful implementations.
• Large on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory and supports high-throughput buffering and local storage.
• Extensive I/O availability: 840 I/Os simplify board-level connectivity for multi-channel or multi-peripheral designs.
• Industrial temperature operation: −40 °C to 100 °C rating supports deployment in demanding environmental conditions.
• High-density BGA package: 1932-ball FCBGA (45×45) package allows compact PCB layouts while maintaining high pin count.
• Low-voltage core domain: 0.87–0.93 V core supply supports modern power-optimized FPGA implementations.

Why Choose 5SGSED6N2F45I2NCV?

This Stratix V GS FPGA balances very large programmable logic and on-chip RAM with a high I/O count and industrial temperature rating, making it well suited for high-density digital systems that require both capacity and environmental robustness. As a member of Intel's Stratix V family, it aligns with documented device offerings and speed-grade options described in the Stratix V device datasheet.

For design teams targeting complex system integration, multi-interface aggregation, or industrial deployments, the 5SGSED6N2F45I2NCV provides the silicon resources, package density, and operating range to scale designs while simplifying board-level I/O planning.

Request a quote or submit an inquiry for pricing and availability to begin specifying the 5SGSED6N2F45I2NCV for your next design.