5SGSED6N2F45I2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 215 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N2F45I2LN – Stratix® V GS FPGA, 583000 logic elements, 1932-BBGA

The 5SGSED6N2F45I2LN is an Intel Stratix V GS field-programmable gate array (FPGA) in a 1932-BBGA FCBGA package designed for DSP-centric, transceiver-enabled applications. Built on the Stratix V family architecture, it combines a high logic capacity with abundant embedded memory and high-density I/O to address bandwidth- and compute-intensive designs.

This industrial-grade device targets applications in wireline, broadcast, military, and high-performance computing markets by providing integrated DSP resources, high-speed transceivers, and on-chip hard IP options for common interfaces.

Key Features

  • Core & Architecture 
    28-nm Stratix V family architecture with redesigned adaptive logic modules (ALMs) and a comprehensive fabric clocking network.
  • Logic Capacity 
    Approximately 583,000 logic elements to implement complex custom logic and control planes.
  • Memory 
    Approximately 46.08 Mbits of embedded memory (total RAM bits) using 20-Kbit (M20K) memory blocks for on-chip buffering and data storage.
  • DSP & Transceivers 
    Stratix V GS variant provides a large complement of variable-precision DSP blocks (family supports up to 3,926 18×18 or 1,963 27×27 multipliers) and integrated transceivers with 14.1-Gbps capability for DSP-heavy, transceiver-based systems.
  • I/O & Package 
    Up to 840 I/Os in a 1932-BBGA (1932-FBGA, FC 45×45) surface-mount package, enabling high-pin-count system integration in compact boards.
  • Power & Thermal 
    Specified core voltage range of 820 mV to 880 mV and operating temperature range of −40 °C to 100 °C for industrial deployments.
  • System Integration 
    Includes an Embedded HardCopy Block to harden IP instantiations such as PCIe Gen3/Gen2/Gen1 for reduced risk when migrating designs to HardCopy ASICs.
  • Compliance 
    RoHS compliant and supplied in a surface-mount FCBGA package suitable for automated assembly.

Typical Applications

  • High-performance DSP systems 
    Leverage variable-precision DSP blocks and large on-chip memory to implement filters, FFTs, and real-time signal processing pipelines.
  • Optical and backplane communications 
    Integrated 14.1-Gbps transceivers and high I/O count support 40G/100G-class transport and backplane interfaces.
  • Network and packet processing 
    Large logic capacity and abundant memory enable packet parsing, traffic management, and custom acceleration functions.
  • Military and broadcast systems 
    Industrial-grade temperature range and high-density I/O suit rugged, high-bandwidth acquisition and processing equipment.

Unique Advantages

  • High logic and memory integration: Combine 583,000 logic elements with approximately 46.08 Mbits of embedded RAM to minimize external memory and simplify board design.
  • DSP-focused architecture: The Stratix V GS variant’s variable-precision DSP resources are tailored for compute-intensive signal-processing workloads.
  • High-speed serial capability: On-chip transceivers with 14.1-Gbps capability enable direct interfacing to high-bandwidth links without additional SerDes devices.
  • Scalable production path: Embedded HardCopy Block support for PCIe IP facilitates a low-risk transition from FPGA prototype to HardCopy ASIC for higher-volume production.
  • Industrial robustness: Operating range from −40 °C to 100 °C and RoHS compliance support deployment in industrial environments.
  • High I/O density in compact package: 840 I/Os in a 1932-BBGA package enable complex system routing while keeping PCB footprint controlled.

Why Choose 5SGSED6N2F45I2LN?

The 5SGSED6N2F45I2LN combines Stratix V family architectural enhancements with the GS variant’s DSP and transceiver strengths to deliver a solution well matched to bandwidth- and compute-heavy designs. Its large logic element count, substantial embedded memory, and high-density I/O make it suitable for systems demanding on-chip processing and high-speed data movement.

Designers and procurement teams seeking a high-capacity, transceiver-equipped FPGA for industrial applications will find this device offers a practical balance of integration, deterministic operating ranges, and a production pathway that can scale toward hardened ASIC implementations.

Request a quote or submit an inquiry to receive pricing and availability for the 5SGSED6N2F45I2LN.

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