5SGSED6N2F45I2G
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 419 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 870 mV - 930 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6N2F45I2G – Stratix® V GS FPGA, Industrial 1932-BBGA FCBGA
The 5SGSED6N2F45I2G is an Intel Stratix® V GS Field Programmable Gate Array (FPGA) IC designed for high-density, high-I/O designs. This device combines large logic capacity and substantial on-chip memory with a high pin count to support complex digital processing, system integration, and I/O-intensive applications.
Key hardware attributes include 583,000 logic elements, approximately 46 Mbits of embedded memory, and up to 840 I/Os. The device is supplied in a 1932-ball BGA (FCBGA) package for surface-mount assembly and is offered in an industrial temperature grade with a core supply range of 870 mV to 930 mV.
Key Features
- Core Logic Capacity 583,000 logic elements to support large, parallelizable designs and complex FPGA fabric implementations.
- Embedded Memory Approximately 46 Mbits of on-chip RAM for buffering, look-up tables, and local data storage.
- High I/O Count Up to 840 user I/Os to accommodate dense connectivity, multi-channel interfaces, and board-level routing requirements.
- Power and Supply Core voltage supply range from 870 mV to 930 mV, enabling defined power-domain planning for system designers.
- Package and Mounting 1932-ball BGA (FCBGA) package, supplier device package 1932-FBGA, FC (45×45), designed for surface-mount assembly.
- Industrial Temperature Grade Rated for operation from −40°C to 100°C for deployment in temperature-challenging environments.
- Stratix V GS Family Part of the Stratix V GS device family; refer to the Stratix V device datasheet for electrical and switching characteristics relevant to system-level design.
Typical Applications
- High-density signal processing — Use the large logic fabric and embedded memory for DSP, packet processing, and algorithm acceleration tasks.
- I/O-intensive systems — High pin count supports multi-channel interfaces, bridging, and dense board-level connectivity.
- Industrial control and automation — Industrial temperature rating and high integration density make it suitable for embedded control and real-time processing in industrial environments.
Unique Advantages
- Substantial logic resources: 583,000 logic elements enable complex state machines, parallel datapaths, and large custom hardware implementations without external PLDs.
- Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces reliance on external memory and lowers system latency for buffering and look-up operations.
- Extensive I/O capability: Up to 840 I/Os simplify integration with multiple peripherals, sensors, and high-throughput interfaces.
- Industrial temperature operation: Rated from −40°C to 100°C to support deployments outside controlled commercial environments.
- Surface-mount, high-density package: 1932-ball FCBGA enables compact PCB layouts while delivering high pin count and signal routing density.
Why Choose 5SGSED6N2F45I2G?
The 5SGSED6N2F45I2G delivers a balance of large logic capacity, abundant embedded memory, and broad I/O in an industrial-grade Stratix V GS FPGA. Its combination of 583,000 logic elements, approximately 46 Mbits of on-chip RAM, and 840 I/Os provides the hardware resources needed for demanding, integration-heavy designs.
Engineers and procurement teams looking for a high-density FPGA solution for industrial environments will find this device suited to compute- and I/O-intensive applications where core supply range, package density, and temperature tolerance are key selection criteria.
Request a quote or submit a procurement inquiry for part number 5SGSED6N2F45I2G to receive pricing, availability, and lead-time information.

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