5SGSED6N2F45C3N

The 5SGSED6N2F45C3N is an Intel Stratix V GS FPGA in a 1932-BBGA (FCBGA) surface-mount package. It delivers high logic capacity and dense on‑chip memory suited for transceiver-centric and DSP-heavy applications.

Built on the Stratix V family architecture, this device targets bandwidth- and data‑intensive applications by combining a large count of logic elements, abundant embedded RAM, integrated transceiver capability (family-level), and a pathway for production migration to HardCopy V ASICs.

Key Features

• Logic Capacity – Contains 583,000 logic elements for complex programmable logic and large-scale custom designs.
• Embedded Memory – Approximately 46 Mbits of on‑chip RAM (total RAM bits: 46,080,000) to support buffering, lookup tables, and data‑intensive processing.
• DSP Resources – Part of the Stratix V GS family, which offers an abundance of variable‑precision DSP blocks for high‑precision signal processing (family-level capability).
• Transceiver Capability – Stratix V GS devices include integrated transceivers with 14.1‑Gbps data‑rate capability (family-level feature useful for backplane and optical interfaces).
• I/O Density – 840 user I/O pins to connect to high‑bandwidth peripherals, memory interfaces, and multi‑lane serial links.
• Package & Mounting – 1932‑BBGA FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) in a surface‑mount form factor.
• Power – Core voltage supply range from 820 mV to 880 mV, enabling low‑voltage core operation.
• Operating Temperature – Rated for commercial operating temperatures from 0 °C to 85 °C.
• Compliance – RoHS compliant.

Typical Applications

• Transceiver-based DSP Systems – Implements high‑precision DSP algorithms using the Stratix V GS family’s variable‑precision DSP blocks and embedded memory.
• High‑Bandwidth Optical and Backplane Interfaces – Leverages family-level integrated transceivers for backplane and optical transport applications.
• Network and Packet Processing – Large logic capacity and high I/O count enable packet handling, traffic management, and protocol processing.
• High‑Performance Computing and Broadcast – Supports data‑intensive compute tasks where dense on‑chip RAM and DSP resources are required.

Unique Advantages

• High logic density: 583,000 logic elements provide the FPGA fabric needed for large, complex designs without immediate partitioning.
• Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM minimizes external memory dependence for buffering and data staging.
• High I/O count: 840 I/O pins allow direct interfacing to multiple high‑speed peripherals and wide parallel buses.
• Low‑voltage core operation: 820–880 mV core supply supports designs targeting reduced core power draw.
• Production scalability: Part of the Stratix V family with a defined path for prototyping and migration to HardCopy V ASICs for higher volume production (family-level option).
• RoHS compliant and surface‑mount package: Simplifies manufacturing and regulatory compliance in commercial products.

Why Choose 5SGSED6N2F45C3N?

The 5SGSED6N2F45C3N combines high logic capacity, large embedded memory, and a high I/O count in a compact 1932‑BBGA FCBGA package, delivering a programmable platform suited to transceiver‑centric and DSP‑focused designs. Its low‑voltage core and Stratix V family features make it appropriate for data‑intensive applications that require dense compute and flexible I/O.

This device is aimed at developers and system designers who need a scalable FPGA solution for prototyping and production migration within the Stratix V ecosystem, offering family-level transceiver and DSP capabilities alongside a pathway to HardCopy V ASICs for volume production.

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