5SGSED6N2F45I2LG

The 5SGSED6N2F45I2LG is a Stratix® V GS field programmable gate array (FPGA) in a 1932-ball FCBGA package. It delivers a high logic capacity and substantial embedded memory with a large I/O count, packaged for dense, high-pin-count system designs.

Designed and specified for industrial-grade operation, this device targets applications that require broad I/O bandwidth, significant on-chip logic and memory resources, and operation across an extended temperature range.

Key Features

• Core & Logic Provides 583,000 logic elements for complex programmable logic implementation and high-density designs.
• Embedded Memory Approximately 46 Mbits of on-chip RAM to support large buffers, caches, and state storage without external memory in many use cases.
• I/O Capacity 840 user I/Os to accommodate wide bus interfaces, parallel peripherals, and high-pin-count interconnects.
• Voltage Supply Core supply range from 820 mV to 880 mV to match system power rails and power-management schemes.
• Package & Mounting 1932-BBGA (FCBGA) supplier device package (1932-FBGA, FC 45×45) with surface-mount mounting for compact, high-density board layouts.
• Temperature & Grade Industrial grade device specified for operation from −40 °C to 100 °C for use in demanding thermal environments.
• Compliance RoHS compliant.

Typical Applications

• Industrial control & automation — Industrial temperature rating (−40 °C to 100 °C) and extensive I/O count make this device suitable for complex control systems and factory automation equipment.
• High-density I/O systems — 840 I/Os and a 1932-BBGA package support applications that require extensive external interfacing or parallel connectivity.
• Compute acceleration and prototyping — Large logic capacity (583,000 logic elements) and substantial on-chip RAM (approximately 46 Mbits) enable hardware acceleration blocks and system prototyping.

Unique Advantages

• High programmable density: 583,000 logic elements enable implementation of large, complex designs without partitioning across multiple FPGAs.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
• Extensive I/O connectivity: 840 I/Os facilitate dense peripheral and system-level interfacing, minimizing board-level routing complexity.
• Industrial temperature operation: Rated −40 °C to 100 °C for deployment in temperature-challenging environments.
• Compact, high-pin-count package: 1932-ball FCBGA (45 × 45 mm) enables a small PCB footprint while providing a large signal count.
• Low-voltage core: 0.82–0.88 V supply range supports modern low-voltage power architectures.

Why Choose 5SGSED6N2F45I2LG?

The 5SGSED6N2F45I2LG combines a high logic element count, substantial embedded memory, and a very large I/O complement in a single industrial-grade FCBGA package. This balance of capacity, connectivity, and thermal tolerance positions the device for system designs that require integrated programmable logic resources and broad external interfacing without sacrificing board density.

Engineers and procurement teams seeking a Stratix V GS family device can rely on the detailed Stratix V device documentation for electrical and switching characteristics while leveraging this part where on-chip resources and industrial operating range are priorities.

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