5SGSED6N2F45C3G

The 5SGSED6N2F45C3G is an Intel Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package. It provides a high logic density of 583,000 logic elements and approximately 46 Mbits of embedded RAM for complex programmable designs.

Key physical and electrical characteristics include 840 user I/O pins, surface-mount 1932-FBGA (45×45 mm) packaging, a core supply range of 820 mV to 880 mV, and a commercial operating temperature range of 0 °C to 85 °C.

Key Features

• Core & Logic  583,000 logic elements for large-scale programmable logic implementation and complex system integration.
• On-chip Memory  Approximately 46 Mbits of embedded RAM to support data buffering, FIFOs, and on-chip storage needs.
• I/O & Connectivity  840 I/O pins to enable extensive external interfacing and multiple parallel or serial I/O configurations.
• Power  Low-voltage core operation with a supply range of 820 mV to 880 mV for the FPGA core domain.
• Package & Mounting  1932-BBGA (FCBGA) surface-mount package; supplier package specified as 1932-FBGA, FC (45×45 mm) for high-density board integration.
• Temperature & Grade  Commercial grade device rated for 0 °C to 85 °C operation.
• System Design Documentation  Device datasheet includes electrical and switching characteristics, I/O timing, programmable I/O element delay, and programmable output buffer delay for design validation.
• Regulatory  RoHS compliant.

Typical Applications

• High-density logic and signal processing  Large-scale programmable logic implementations that benefit from 583,000 logic elements and significant on-chip RAM.
• I/O-intensive control and interfacing  Designs requiring many external connections can leverage the device’s 840 I/O pins for complex peripheral and bus interfacing.
• Board-level, space-constrained systems  The 1932-BBGA (45×45 mm) surface-mount package supports compact, high-density PCB layouts.

Unique Advantages

• High logic density: 583,000 logic elements enable integration of large functional blocks and reduce the need for multiple devices.
• Substantial embedded memory: Approximately 46 Mbits of on-chip RAM simplifies buffering and reduces external memory dependency.
• Extensive I/O capability: 840 I/O pins offer flexibility for parallel interfaces, multiple peripherals, and complex interconnects.
• Low-voltage core operation: Core supply range of 820 mV to 880 mV supports modern low-voltage system architectures.
• Commercial temperature rating: Specified 0 °C to 85 °C operating range for mainstream electronic products.
• RoHS compliance: Meets common lead-free manufacturing and environmental requirements.

Why Choose 5SGSED6N2F45C3G?

The 5SGSED6N2F45C3G positions itself as a high-density programmable solution within the Stratix V GS family, combining a large logic resource pool, significant embedded RAM, and high I/O availability in a compact FCBGA package. These characteristics make it suitable for board designs that require substantial on-chip resources and broad external connectivity while maintaining a commercial temperature profile.

Engineers and procurement teams looking for a robust FPGA option with documented electrical and switching characteristics can rely on the device’s datasheet for detailed I/O timing and performance parameters, enabling informed design and validation decisions.

Please request a quote or submit an inquiry specifying part number 5SGSED6N2F45C3G to obtain pricing, availability, and ordering options.