5SGSED6N2F45C2LG

The 5SGSED6N2F45C2LG is a Stratix V GS field‑programmable gate array (FPGA) offered in a 1932‑ball FCBGA package. It provides a large logic capacity and significant on‑chip memory, making it suitable for designs that require dense logic, large embedded memory, and extensive I/O connectivity.

With 583,000 logic elements, approximately 46 Mbits of embedded RAM, and 840 user I/O pins, this commercial‑grade device targets complex digital signal processing, high‑density I/O subsystems, and compute‑intensive FPGA workloads where integration and high logic/memory capacity are key.

Key Features

• Logic Capacity — 583,000 logic elements (cells) to implement large, complex designs and parallel processing architectures.
• Embedded Memory — Approximately 46 Mbits of total on‑chip RAM for buffering, FIFOs, and local data storage.
• I/O Density — 840 device I/O pins to support wide interfaces, dense board routing, and multiple peripheral connections.
• Power Supply — Core supply range specified at 820 mV to 880 mV, enabling designs that follow the device’s core voltage requirements.
• Package and Mounting — 1932‑BBGA FCBGA (supplier package: 1932‑FBGA, FC 45×45); surface‑mount package suitable for high‑pin‑count PCB designs.
• Commercial Temperature Grade — Rated for operation from 0 °C to 85 °C for standard commercial applications.
• RoHS Compliant — Device conforms to RoHS requirements.

Typical Applications

• High‑density signal processing — Large logic capacity and embedded RAM support DSP pipelines, hardware accelerators, and complex algorithm implementations.
• High‑pin‑count I/O systems — 840 I/Os enable wide parallel interfaces, multi‑lane data aggregation, and extensive peripheral connectivity.
• Data buffering and packet processing — Substantial on‑chip memory is useful for buffering, FIFOs, and flow management in networking or data acquisition systems.

Unique Advantages

• Substantial logic resources: 583,000 logic elements allow integration of large designs on a single device, reducing multi‑chip BOM complexity.
• Significant embedded memory: Approximately 46 Mbits of RAM enables on‑chip data storage and low‑latency buffering without external memory for many use cases.
• High I/O count: 840 I/Os provide flexibility for complex board interfaces, sensor arrays, and parallel data paths.
• Package suited for dense boards: 1932‑ball FCBGA in a 45×45 form factor supports high‑pin‑count PCB routing while maintaining a single‑device implementation.
• Commercial temperature rating: Specification from 0 °C to 85 °C aligns with standard commercial deployments and system environments.
• RoHS compliant: Conforms to environmental regulations for lead‑free manufacturing.

Why Choose 5SGSED6N2F45C2LG?

The 5SGSED6N2F45C2LG combines high logic density, substantial embedded RAM, and a large number of I/Os in a surface‑mount FCBGA package to support complex, integrated FPGA designs. Its commercial temperature rating and RoHS compliance make it suitable for standard commercial products requiring robust on‑chip resources.

This device is well suited to engineers and system designers who need to consolidate logic‑intensive functions, large local memory, and extensive I/O into a single FPGA platform, simplifying board design and reducing component count while leveraging the Stratix V series device characteristics described in the product documentation.

Request a quote or submit a purchase inquiry to receive pricing and availability for the 5SGSED6N2F45C2LG.