5SGSED6N2F45I3L

The 5SGSED6N2F45I3L is a Stratix V GS field programmable gate array (FPGA) from Intel, delivered in a 1932-BBGA (FCBGA) package for surface-mount assembly. It provides a large logic fabric and abundant I/O, together with substantial on-chip RAM, for complex, programmable digital designs.

This device is offered in an industrial temperature grade and is specified with an operating temperature range of −40 °C to 100 °C and a core supply range of 820 mV to 880 mV, making it suitable for designs that require high logic capacity and robust temperature performance.

Key Features

• Logic Capacity  Approximately 583,000 logic elements to implement complex custom logic and compute pipelines.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, packet processing, and local data storage.
• I/O Density  840 user I/O pins to support large multi-interface designs and high connector/peripheral counts.
• Package & Mounting  1932-BBGA (FCBGA) package, supplier package listed as 1932-FBGA, FC (45×45); surface-mount device for standard PCB assembly.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C for industrial applications.
• Core Voltage Range  Specified supply range of 820 mV to 880 mV to support power-domain planning and regulation strategies.
• Standards & Compliance  RoHS compliant.
• Family Documentation  Part of the Intel Stratix V family; electrical and switching characteristics (including I/O timing and operating conditions) are documented in the Stratix V device datasheet.

Typical Applications

• High-density I/O systems  Use the device’s 840 I/O pins to connect many peripherals, interfaces, and external memory channels in a single FPGA.
• Large-scale custom logic  Leverage approximately 583,000 logic elements to implement complex state machines, datapaths, and hardware accelerators.
• On-chip buffering and packet processing  Employ the ~46 Mbits of embedded RAM for frame buffers, FIFOs, and intermediate storage in high-throughput designs.
• Industrial environments  Designed to operate across −40 °C to 100 °C, suitable for industrial-grade applications requiring extended temperature operation.

Unique Advantages

• High logic density: Approximately 583,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
• Substantial on-chip memory: Around 46 Mbits of embedded RAM minimizes reliance on external memory for many buffering and caching tasks.
• Extensive I/O capability: 840 I/O pins provide flexibility for dense peripheral and interface integration without multiplexing compromises.
• Industrial temperature rating: −40 °C to 100 °C operation supports deployment in demanding environmental conditions.
• Compact, assembly-ready package: 1932-BBGA (FCBGA) surface-mount package supports high-density PCB designs and standard SMT processes.
• Regulated core supply range: 820 mV–880 mV allows precise power-domain design for the FPGA core.

Why Choose 5SGSED6N2F45I3L?

The 5SGSED6N2F45I3L combines large programmable logic capacity, significant embedded memory, and very high I/O count in a single industrial-grade Stratix V GS FPGA package. It is targeted at designs that require integration of complex logic, extensive interfacing, and reliable operation across a wide temperature range.

As part of the Intel Stratix V family, this device is documented within the Stratix V device datasheet for electrical and switching characteristics, enabling engineering teams to plan power, timing, and thermal requirements with detailed reference information.

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