5SGSED6N2F45I3N

The 5SGSED6N2F45I3N is a Stratix® V GS Field Programmable Gate Array (FPGA) offered in an industrial temperature grade. It provides very high logical density and on‑chip memory in a large‑pin, fine‑pitch ball grid array package for designs requiring substantial I/O and embedded RAM.

With 583,000 logic elements, approximately 46.08 Mbits of embedded memory and 840 I/O pins, this device targets high‑density, high‑I/O applications where board‑level integration and robust temperature operation (‑40 °C to 100 °C) are required. The device operates from a core supply in the 820 mV–880 mV range and is supplied in a 1932‑FBGA FCBGA surface‑mount package.

Key Features

• Logic Capacity — 583,000 logic elements for large, complex digital designs and extensive gate‑level implementation.
• Embedded Memory — Approximately 46.08 Mbits of on‑chip RAM to support large buffering, lookup tables, and on‑device data storage.
• I/O Density — 840 programmable I/O pins to interface with many peripherals, high‑speed buses, and parallel data paths.
• Power and Core Voltage — Core supply range of 820 mV to 880 mV to match system power‑rail architectures and power management designs.
• Package and Mounting — 1932‑FBGA (FC, 45×45) FCBGA package, surface mount, suitable for high‑pin‑count PCB layouts.
• Industrial Temperature Grade — Rated for operation from ‑40 °C to 100 °C for deployment in industrial environments.
• Compliance — RoHS compliant for global regulatory and manufacturing requirements.

Typical Applications

• High‑density digital processing — Implement complex algorithms and wide parallel pipelines using the device’s large logic and memory resources.
• High‑I/O system controllers — Manage large numbers of interfaces and peripherals with the 840 available I/O pins.
• Industrial control and automation — Deploy in systems that require extended temperature range and reliable on‑device resources for real‑time control functions.

Unique Advantages

• Substantial logic and memory in one device: 583,000 logic elements and ~46.08 Mbits of embedded RAM reduce the need for external FPGA fabrics or large external memory banks.
• Extensive I/O connectivity: 840 I/O pins simplify integration with multiple peripherals, sensors, and high‑pin‑count interfaces on a single PCB.
• Industrial temperature operation: Rated from ‑40 °C to 100 °C for reliable performance in demanding environmental conditions.
• High‑pin‑count BGA package: 1932‑FBGA package supports dense routing and compact board layouts while enabling the device’s full I/O and power distribution.
• RoHS compliant: Supports regulatory and manufacturing requirements for lead‑free production.

Why Choose 5SGSED6N2F45I3N?

The 5SGSED6N2F45I3N positions itself as a high‑capacity, industrial‑grade Stratix V GS FPGA designed for applications that require abundant logic resources, substantial embedded memory and a large complement of I/O. Its combination of 583,000 logic elements, approximately 46.08 Mbits of on‑chip RAM and 840 I/O pins enables consolidation of complex system functions onto a single device, simplifying board-level design and reducing BOM complexity.

This device is suitable for engineering teams building high‑density digital systems and industrial controllers that need deterministic operation across a wide temperature range, compact packaging, and compliance with RoHS requirements.

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