5SGSED6N3F45C2LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,930 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N3F45C2LN – Stratix V GS FPGA, 583,000 logic elements, 840 I/O, 1932-BBGA

The 5SGSED6N3F45C2LN is a Stratix® V GS field-programmable gate array (FPGA) in a 1932-BBGA (45×45) FCBGA package. Built on Stratix V family architecture, this device combines a high logic count, substantial on-chip memory, dedicated DSP resources and transceiver capability to address transceiver‑based, DSP‑centric applications.

Targeted use cases include high-performance signal processing, wireline and broadcast communications, and compute-accelerated subsystems where large logic capacity, abundant embedded memory and high-speed I/O are required.

Key Features

  • Process & core architecture — Stratix V family architecture with 28‑nm process characteristics and redesigned adaptive logic modules (ALMs) for programmable logic integration.
  • Logic capacity — 583,000 logic elements suitable for large FPGA implementations and complex system integration on a single device.
  • Embedded memory — Approximately 46 Mbits of on-chip RAM (Total RAM Bits: 46,080,000) organized in M20K-style memory blocks for buffering and local data storage.
  • Dedicated DSP resources — GS variant DSP fabric supporting variable-precision multipliers, including support for up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput signal processing.
  • Transceiver capability — Integrated transceivers with 14.1‑Gbps data‑rate capability suitable for backplane and optical interface applications.
  • I/O and packaging — 840 I/O pins in a 1932‑BGA FCBGA package (supplier package: 1932‑FBGA, FC 45×45); surface-mount mounting type for board-level assembly.
  • Power & supply — Core voltage supply range of 820 mV to 880 mV, allowing designers to target the device within a defined power envelope.
  • Clocking and system IP — Fabric clocking network with fractional PLLs and an Embedded HardCopy Block for hard IP instantiation (PCIe Gen support described at the family level).
  • Operating conditions & compliance — Commercial-grade operation from 0 °C to 85 °C and RoHS compliant.

Typical Applications

  • High‑performance DSP systems — Large DSP multiplier counts and abundant logic make the device well suited for signal processing pipelines, filtering and real‑time data transformations.
  • Wireline and backplane communications — Integrated transceivers and high I/O count enable protocol handling and high‑speed serial links for networking and switching equipment.
  • Broadcast and video processing — On‑chip memory and DSP resources support real‑time video encoding, transcoding and processing workflows.
  • Compute acceleration and HPC subsystems — High logic density and DSP capability support custom hardware acceleration blocks for compute‑intensive tasks.

Unique Advantages

  • High logic density: 583,000 logic elements provide headroom for complex system integration and large FPGA designs on a single device.
  • Substantial on‑chip memory: Approximately 46 Mbits of embedded RAM reduce external memory dependency and improve data locality for high‑throughput designs.
  • DSP‑centric resources: Variable‑precision DSP multipliers (up to 3,926 18×18 or 1,963 27×27) enable efficient implementation of arithmetic‑intensive algorithms.
  • High‑speed I/O ecosystem: 840 I/O pins combined with 14.1‑Gbps transceiver capability support demanding interface and transport requirements.
  • Integrated system IP: Embedded HardCopy Block and fractional PLLs provide options for hardened IP instantiation and advanced clocking strategies.
  • Commercial readiness and compliance: Surface-mount FCBGA package with commercial temperature range and RoHS compliance for standard production environments.

Why Choose 5SGSED6N3F45C2LN?

The 5SGSED6N3F45C2LN positions itself as a high‑capacity, DSP‑oriented Stratix V GS FPGA that brings together large programmable logic, significant embedded memory and dedicated multiplier resources in a single 1932‑BGA package. Its 840 I/O and integrated transceiver capability make it appropriate for systems that require both dense logic and high‑speed connectivity.

Designers targeting transceiver‑based signal processing, broadcast, wireline communications or compute acceleration will find this device suited for prototyping and deployment where commercial-grade operation and a path to hardened ASIC implementations are desirable.

Request a quote or submit a procurement inquiry to get pricing and availability for the 5SGSED6N3F45C2LN. Our team can provide lead‑time and ordering details to support your design schedule.

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