5SGSED6N3F45C3G

The 5SGSED6N3F45C3G is a Stratix V GS family Field Programmable Gate Array (FPGA) from Intel, offered in a high-density FCBGA package. It provides substantial programmable logic capacity, on-chip memory, and a large I/O complement for complex digital systems.

Designed for commercial-grade applications, this device targets designs that require significant logic resources, embedded memory, and dense external connectivity while operating within standard commercial temperature and voltage ranges.

Key Features

• Core logic capacity — Approximately 583,000 logic elements (logic cells) to implement large-scale custom logic and complex datapaths.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM for buffering, lookup tables, and state storage.
• I/O density — Up to 840 user I/O pins to support wide interfaces and high pin-count system integration.
• Packaging and mounting — 1932-BBGA (FCBGA) package, supplier package 1932-FBGA, FC (45×45); surface-mount mounting for board-level assembly.
• Power requirements — Core supply range specified at 820 mV to 880 mV (0.82–0.88 V).
• Commercial grade operating range — Rated for 0 °C to 85 °C operating temperature.
• Environmental compliance — RoHS compliant.

Typical Applications

• High-density logic systems — Implement large custom logic functions and datapaths using the device’s ~583,000 logic elements and abundant embedded RAM.
• I/O-intensive designs — Support multi-channel interfaces, wide buses, and complex board-level connectivity with up to 840 I/O pins.
• Commercial electronic products — Deploy in commercial-temperature systems that operate between 0 °C and 85 °C and require RoHS compliance.

Unique Advantages

• High on-chip logic and memory — Large logic element count and approximately 46 Mbits of embedded RAM reduce the need for external memory and simplify system architecture.
• Dense external connectivity — 840 I/O pins enable integration of numerous peripherals and high-bandwidth interfaces without extensive external interface chips.
• Compact surface-mount package — 1932-BBGA FCBGA in a 45×45 supplier package supports compact, high-density board designs.
• Low-voltage core operation — Core supply specified between 0.82 V and 0.88 V supports optimized power delivery and power-plan design.
• Commercial temperature rating — Rated 0 °C to 85 °C for mainstream commercial deployments.
• Regulatory compliance — RoHS-compliant for environmental requirements.

Why Choose 5SGSED6N3F45C3G?

The 5SGSED6N3F45C3G combines a high logic element count, substantial on-chip memory, and a large I/O footprint in a single commercial-grade Stratix V GS FPGA. It is well suited to designs that demand dense programmable logic, significant local RAM, and broad external connectivity while operating within standard commercial temperature and voltage ranges.

Backed by Intel’s Stratix V device documentation and ecosystem, this device provides a stable platform for scalable digital designs where logic capacity, embedded memory, and I/O density are primary selection criteria.

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