5SGSED6N3F45C4N
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 1,349 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unknown | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | 3A001A2C | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6N3F45C4N – Stratix V GS FPGA, 583,000 logic elements, 840 I/O, 1932-BBGA
The 5SGSED6N3F45C4N is a Stratix® V GS field-programmable gate array (FPGA) offered by Intel. It combines a high logic element count with abundant embedded memory, extensive I/O, and integrated transceiver and DSP capabilities targeted at transceiver-based, DSP-centric designs.
Built on 28‑nm process technology, this commercial‑grade device is suited for high‑performance signal processing, wireline/broadcast communications, and data‑intensive networking applications that require dense logic, sizable on‑chip memory, and substantial I/O connectivity.
Key Features
- Core / Logic Approximately 583,000 logic elements provide substantial programmable fabric for complex designs and high logic density.
- Embedded Memory Approximately 46.08 Mbits of total on‑chip RAM, implemented with 20‑Kbit (M20K) embedded memory blocks for large buffering and fast local storage.
- Variable‑Precision DSP Stratix V GS family includes variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput signal processing workloads.
- Integrated Transceivers Integrated transceivers with 14.1‑Gbps data‑rate capability provide high‑speed serial connectivity suitable for backplane and optical interface applications.
- I/O Density 840 I/O pins enable broad external interfacing and flexible board‑level integration.
- Power Supply Device supply range specified at 820 mV to 880 mV to match system power‑delivery requirements.
- Package & Mounting 1932‑BBGA, FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface‑mount construction for dense board layouts.
- Operating Range & Grade Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
- System Integration Family features include a redesigned adaptive logic module (ALM), multi‑track routing, fractional PLLs, and an Embedded HardCopy block for hardened IP instantiation.
Typical Applications
- High‑Performance DSP Accelerated signal processing and algorithm implementation using the device's variable‑precision DSP blocks and large on‑chip memory.
- Wireline and Broadcast Systems Transceiver‑based architectures for backplane and optical interfaces leveraging integrated 14.1‑Gbps transceivers and extensive I/O.
- Network & Packet Processing Data‑intensive networking functions that require high logic density, large local RAM, and significant I/O bandwidth.
- Prototyping and ASIC Migration FPGA prototyping with a path to low‑risk HardCopy V ASIC implementation using the Embedded HardCopy block.
Unique Advantages
- High logic and memory density: Combines ~583,000 logic elements with ~46.08 Mbits of embedded RAM to implement complex, stateful systems on a single device.
- DSP‑centric architecture: Variable‑precision DSP resources (up to 3,926 18×18 or 1,963 27×27 multipliers) accelerate multiply‑intensive workloads without external accelerators.
- High‑speed serial connectivity: Integrated 14.1‑Gbps transceivers support high‑bandwidth data movement for optical and backplane applications.
- Extensive I/O capability: 840 I/O pins provide flexibility for complex board interfaces and multiple peripheral subsystems.
- Commercial temperature and compliance: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.
- Dense package for compact designs: 1932‑BBGA FCBGA surface‑mount package enables high‑density PCB implementations.
Why Choose 5SGSED6N3F45C4N?
The 5SGSED6N3F45C4N delivers a balance of high logic capacity, sizable embedded memory, rich DSP resources, and high‑speed transceivers within the Stratix V GS family. It targets engineers building DSP‑centric, transceiver‑based systems that demand on‑chip compute and bandwidth without excessive external components.
As part of the Stratix V family, this device offers a path for prototyping and potential ASIC migration, alongside documented family‑level features such as adaptive logic modules, M20K memory blocks, and Embedded HardCopy functionality—providing a scalable platform for evolving product requirements.
Request a quote or submit an inquiry for pricing and availability to evaluate 5SGSED6N3F45C4N for your next design.

Date Founded: 1968
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