5SGSED6N3F45C4N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,349 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N3F45C4N – Stratix V GS FPGA, 583,000 logic elements, 840 I/O, 1932-BBGA

The 5SGSED6N3F45C4N is a Stratix® V GS field-programmable gate array (FPGA) offered by Intel. It combines a high logic element count with abundant embedded memory, extensive I/O, and integrated transceiver and DSP capabilities targeted at transceiver-based, DSP-centric designs.

Built on 28‑nm process technology, this commercial‑grade device is suited for high‑performance signal processing, wireline/broadcast communications, and data‑intensive networking applications that require dense logic, sizable on‑chip memory, and substantial I/O connectivity.

Key Features

  • Core / Logic  Approximately 583,000 logic elements provide substantial programmable fabric for complex designs and high logic density.
  • Embedded Memory  Approximately 46.08 Mbits of total on‑chip RAM, implemented with 20‑Kbit (M20K) embedded memory blocks for large buffering and fast local storage.
  • Variable‑Precision DSP  Stratix V GS family includes variable‑precision DSP blocks supporting up to 3,926 18×18 or 1,963 27×27 multipliers for high‑throughput signal processing workloads.
  • Integrated Transceivers  Integrated transceivers with 14.1‑Gbps data‑rate capability provide high‑speed serial connectivity suitable for backplane and optical interface applications.
  • I/O Density  840 I/O pins enable broad external interfacing and flexible board‑level integration.
  • Power Supply  Device supply range specified at 820 mV to 880 mV to match system power‑delivery requirements.
  • Package & Mounting  1932‑BBGA, FCBGA package (supplier device package: 1932‑FBGA, FC 45×45) with surface‑mount construction for dense board layouts.
  • Operating Range & Grade  Commercial grade operation from 0 °C to 85 °C; RoHS compliant.
  • System Integration  Family features include a redesigned adaptive logic module (ALM), multi‑track routing, fractional PLLs, and an Embedded HardCopy block for hardened IP instantiation.

Typical Applications

  • High‑Performance DSP  Accelerated signal processing and algorithm implementation using the device's variable‑precision DSP blocks and large on‑chip memory.
  • Wireline and Broadcast Systems  Transceiver‑based architectures for backplane and optical interfaces leveraging integrated 14.1‑Gbps transceivers and extensive I/O.
  • Network & Packet Processing  Data‑intensive networking functions that require high logic density, large local RAM, and significant I/O bandwidth.
  • Prototyping and ASIC Migration  FPGA prototyping with a path to low‑risk HardCopy V ASIC implementation using the Embedded HardCopy block.

Unique Advantages

  • High logic and memory density: Combines ~583,000 logic elements with ~46.08 Mbits of embedded RAM to implement complex, stateful systems on a single device.
  • DSP‑centric architecture: Variable‑precision DSP resources (up to 3,926 18×18 or 1,963 27×27 multipliers) accelerate multiply‑intensive workloads without external accelerators.
  • High‑speed serial connectivity: Integrated 14.1‑Gbps transceivers support high‑bandwidth data movement for optical and backplane applications.
  • Extensive I/O capability: 840 I/O pins provide flexibility for complex board interfaces and multiple peripheral subsystems.
  • Commercial temperature and compliance: Designed for 0 °C to 85 °C operation and RoHS compliance for mainstream electronics applications.
  • Dense package for compact designs: 1932‑BBGA FCBGA surface‑mount package enables high‑density PCB implementations.

Why Choose 5SGSED6N3F45C4N?

The 5SGSED6N3F45C4N delivers a balance of high logic capacity, sizable embedded memory, rich DSP resources, and high‑speed transceivers within the Stratix V GS family. It targets engineers building DSP‑centric, transceiver‑based systems that demand on‑chip compute and bandwidth without excessive external components.

As part of the Stratix V family, this device offers a path for prototyping and potential ASIC migration, alongside documented family‑level features such as adaptive logic modules, M20K memory blocks, and Embedded HardCopy functionality—providing a scalable platform for evolving product requirements.

Request a quote or submit an inquiry for pricing and availability to evaluate 5SGSED6N3F45C4N for your next design.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up