5SGSED6N3F45I3G

The 5SGSED6N3F45I3G is a Stratix® V GS field programmable gate array (FPGA) in a 1932-BBGA FCBGA package, manufactured by Intel. This industrial-grade FPGA provides very large logic capacity, substantial on-chip memory, and a high I/O count suitable for complex, high-density digital designs.

Designed for applications that require extensive programmable logic, abundant embedded memory, and wide connectivity, the device targets system designs where integration, thermal range, and board-level packaging are key considerations.

Key Features

• Logic Capacity  583,000 logic elements enabling high-density programmable logic implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM (46,080,000 total RAM bits) to support memory-intensive algorithms and buffering.
• High I/O Count  840 I/O pins to accommodate large numbers of external interfaces and parallel connections.
• Core Voltage  Operates at a core supply range of 820–880 mV, supporting low-voltage core operation requirements.
• Package & Mounting  1932-BBGA FCBGA package (supplier package: 1932-FBGA, FC 45×45) with surface-mount mounting for compact board-level integration.
• Temperature & Grade  Industrial grade device rated for operation from –40 °C to 100 °C, suitable for extended-temperature applications.
• RoHS Compliant  Device meets RoHS requirements for restricted substances.

Typical Applications

• High-density digital processing  Large-scale logic implementations that leverage 583,000 logic elements for complex state machines, custom accelerators, and parallel datapaths.
• Memory-intensive algorithms  Designs requiring substantial on-chip buffering and working memory can use the device’s approximately 46 Mbits of embedded RAM.
• High-connectivity systems  Systems that need many external interfaces—sensors, buses, or parallel I/O—can take advantage of the 840 I/O pins.
• Industrial controls and equipment  Applications demanding an industrial temperature range (–40 °C to 100 °C) and durable packaging for long-term deployment.

Unique Advantages

• High logic density: 583,000 logic elements provide the capacity to consolidate multiple functions into a single FPGA, reducing board-level component count.
• Significant on-chip memory: Approximately 46 Mbits of RAM enables local data storage for buffering, lookup tables, and streaming algorithms without external memory dependencies.
• Extensive I/O availability: 840 I/O pins simplify integration with large sensor arrays, parallel interfaces, or multi-channel data paths.
• Industrial temperature rating: Operation from –40 °C to 100 °C supports deployments in harsher environments where extended temperature performance is required.
• Compact FCBGA packaging: The 1932-ball FCBGA (45×45) surface-mount package enables high pin density in a compact footprint for space-constrained PCBs.
• Low-voltage core operation: Core supply range of 820–880 mV supports designs optimized for low-voltage power domains.

Why Choose 5SGSED6N3F45I3G?

The 5SGSED6N3F45I3G positions itself as a high-capacity, industrial-grade Stratix V GS FPGA that balances large programmable logic resources, substantial embedded memory, and a high I/O count in a single FCBGA package. Its core voltage range and surface-mount 1932-ball package make it suitable for compact, power-conscious systems that still require significant on-chip resources.

This device is well suited to engineering teams building complex digital systems that need scalability and robust thermal performance. Backed by the Stratix V device documentation, the part is intended for designs where integration density, on-chip memory, and broad connectivity are primary requirements.

Request a quote or submit an inquiry to receive pricing and availability information for the 5SGSED6N3F45I3G Stratix® V GS FPGA.