5SGSED6N3F45I3LG

The 5SGSED6N3F45I3LG is a Stratix V GS family FPGA delivered in a high-density FCBGA package. This device provides a large logic fabric, substantial on-chip memory, and a high I/O count for designs that require significant integration of digital logic, buffering, and peripheral interfaces.

Designed for industrial-grade operation, the device supports low-voltage core operation and an extended operating temperature range, enabling deployment in temperature-demanding environments while maintaining high integration density.

Key Features

• Logic Capacity  Approximately 583,000 logic elements and about 220,000 logic array blocks to implement complex digital systems and custom accelerators.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for large buffers, FIFOs, and memory-intensive processing tasks.
• High I/O  840 general-purpose I/O pins to support dense connectivity and multi-channel interfacing.
• Power  Core voltage supply specified between 820 mV and 880 mV to match low-voltage core power domains.
• Package & Mounting  Supplied in a 1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45). Surface-mount mounting type.
• Industrial Temperature Grade  Rated for operation from −40 °C to 100 °C, suitable for environments requiring extended thermal range.
• RoHS Compliant  Device meets RoHS requirements for lead-free and restricted substance compliance.

Typical Applications

• I/O-Intensive Systems  Use the device’s 840 I/O pins for multi-channel interfacing, dense peripheral aggregation, and high-density connectivity tasks.
• Memory-Heavy Processing  Leverage approximately 46 Mbits of embedded RAM for buffering, packet processing, or large on-chip data structures.
• High-Density Logic Integration  Implement complex digital functions and custom accelerators using the device’s ~583,000 logic elements and extensive logic array blocks.
• Industrial Temperature Deployments  Industrial-grade rating and −40 °C to 100 °C operation make the device suitable for temperature-challenging installations.

Unique Advantages

• High logic density: Enables consolidation of large digital designs onto a single device, reducing board-level complexity.
• Substantial on-chip memory: Approximately 46 Mbits of RAM reduces reliance on external memory for many buffering and data-path tasks.
• Extensive I/O budget: 840 I/O pins facilitate dense external interfacing without added I/O expanders.
• Industrial temperature range: −40 °C to 100 °C rating supports deployment in thermally demanding environments.
• Compact FCBGA packaging: 1932-ball FCBGA in a 45×45 format enables high-density routing for space-constrained boards.
• Low-voltage core operation: 820–880 mV supply range supports low-power core domains where applicable.

Why Choose 5SGSED6N3F45I3LG?

The 5SGSED6N3F45I3LG balances very high logic capacity, substantial embedded memory, and a large I/O complement in a single industrial-grade FCBGA package. Its specifications suit designs that require dense digital integration, significant on-chip buffering, and robust connectivity while operating across an extended temperature range.

As a member of the Stratix V GS family, this device is positioned for engineers who need high integration and flexibility in FPGA-based systems and who value detailed documentation and device-grade specifications for reliable implementation.

If you would like pricing, availability, or a formal quote for 5SGSED6N3F45I3LG, submit an inquiry to request a quote or additional ordering information.