5SGSED6N3F45I4G

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,584 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusActive
Manufacturer Standard Lead Time26 Weeks
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCNN/AHTS CodeN/A
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N3F45I4G – Stratix® V GS FPGA, 583,000 logic elements, 1932-BBGA FCBGA

The 5SGSED6N3F45I4G is a Stratix® V GS field programmable gate array (FPGA) IC from Intel, provided in an industrial temperature grade. It delivers a large programmable fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory to support high-density designs.

This device includes 840 user I/O pins and is supplied in a 1932-BBGA (FCBGA) surface-mount package (1932-FBGA, FC 45×45). Electrical and switching characteristics—including operating conditions, power, and I/O timing—are documented in the device datasheet.

Key Features

  • Logic Fabric  583,000 logic elements for complex, high-capacity programmable logic implementations.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, FIFOs, and data-path storage.
  • Extensive I/O  840 user I/O pins to interface with multiple external devices and buses.
  • Power Supply  Core voltage range specified at 820 mV to 880 mV for device operation.
  • Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C, suited to industrial environments.
  • Packaging & Mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type.
  • Regulatory  RoHS compliant.
  • Datasheet Coverage  Electrical and switching characteristics, I/O timing, and programmable I/O element/output buffer delay are provided in the Stratix V device documentation.

Typical Applications

  • Programmable logic implementations  Large logic capacity and embedded memory make the device suitable for complex, custom logic and control functions.
  • I/O‑intensive systems  High I/O count supports multi-interface boards and dense peripheral connectivity requirements.
  • Industrial control and instrumentation  Industrial temperature rating and robust packaging support deployment in industrial-grade systems.
  • Memory‑centric data paths  On-chip RAM enables buffering and local data storage for real-time processing and datapath designs.

Unique Advantages

  • High logic density: 583,000 logic elements provide substantial programmable resources to implement large designs without immediate escalation to multi-chip solutions.
  • Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduces dependence on external memory for many buffering and storage needs.
  • Broad I/O capability: 840 I/Os enable rich external interfacing and flexible board-level integration.
  • Industrial operating range: –40 °C to 100 °C rating supports deployment in industrial environments where extended temperature tolerance is required.
  • Compact FCBGA package: 1932-BBGA (45×45) surface-mount package balances high pin count with a compact footprint.
  • Standards-aware supply: RoHS compliance supports environmental and manufacturing requirements.

Why Choose 5SGSED6N3F45I4G?

The 5SGSED6N3F45I4G combines a high-density Stratix V GS programmable fabric with significant embedded memory and a high I/O count, all in a 1932-BBGA surface-mount package rated for industrial temperatures. It is a fit for designers who require large on-chip resources, extensive connectivity, and industrial-grade thermal tolerance backed by Intel’s Stratix V device documentation.

Choose this device when your design requires a balance of logic capacity, on-chip RAM, and I/O density in a compact, industry-rated package with documented electrical and switching characteristics.

Request a quote or submit a sales inquiry to receive pricing and availability for the 5SGSED6N3F45I4G.

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