5SGSED6N3F45I4N

The 5SGSED6N3F45I4N is an Intel Stratix® V GS field programmable gate array (FPGA) supplied in a 1932-ball FCBGA package. It integrates a large fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory, making it suitable for complex, high‑density digital designs.

With 840 user I/O, surface-mount packaging (1932-BBGA / 1932-FBGA, 45×45), industrial temperature grading (-40 °C to 100 °C), and a core voltage supply range of 820 mV to 880 mV, this device targets applications that require high I/O count, substantial on-chip RAM, and operation across extended temperature ranges.

Key Features

• Large Logic Capacity  583,000 logic elements to implement complex combinational and sequential logic designs.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and intermediate storage.
• High I/O Density  840 user I/O pins to support broad interface needs and multi-channel connectivity.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C to meet demanding environmental requirements.
• Low-Voltage Core  Core supply range of 820 mV to 880 mV for designs that are optimized around modern low-voltage FPGA cores.
• Package and Mounting  1932-BBGA / 1932-FBGA surface-mount package (45×45 mm) suitable for high-density board implementations.
• Standards Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• Data Processing & Acceleration  Large logic capacity and substantial embedded RAM enable implementation of hardware accelerators, packet processing, and custom compute pipelines.
• Communications & Networking  High I/O count supports multi‑lane interfaces and complex protocol bridging in network infrastructure equipment.
• Industrial Control & Automation  Industrial temperature rating and robust packaging make the device suitable for factory automation, motion control, and high‑reliability systems.
• High-Density System Integration  Surface-mount FCBGA package and wide I/O enable compact, high-functionality board designs where board space and I/O routing are critical.

Unique Advantages

• High Logic and Memory Integration: Combines 583,000 logic elements with ~46 Mbits of embedded RAM to reduce external memory needs and simplify system architecture.
• Extensive I/O Capability: 840 I/O pins provide flexibility for multi-protocol connectivity and dense peripheral interfacing without external multiplexers.
• Designed for Industrial Environments: -40 °C to 100 °C operating range supports deployments in temperature-challenging applications.
• Compact High‑Density Package: 1932-ball FCBGA (45×45 mm) packaging enables integration into space-constrained, high-performance boards.
• Regulatory Compliance: RoHS compliance supports lead‑free manufacturing and environmental requirements.

Why Choose 5SGSED6N3F45I4N?

The 5SGSED6N3F45I4N positions itself as a high-capacity Stratix® V GS FPGA option for designs that demand large logic resources, significant on-chip memory, and broad I/O capability within an industrial temperature range. Its low-voltage core and dense FCBGA packaging suit integrated systems where performance, board density, and environmental robustness are key considerations.

This device is appropriate for engineering teams implementing complex signal processing, data center acceleration tasks, communications infrastructure, or industrial control systems that benefit from a highly configurable, high‑resource FPGA fabric with long-term availability and standard regulatory compliance.

Request a quote or submit an inquiry to discuss availability, pricing, and integration support for the 5SGSED6N3F45I4N.