5SGSED6N3F45I3LN

The 5SGSED6N3F45I3LN is a Stratix® V GS Field Programmable Gate Array (FPGA) IC manufactured by Intel. This industrial-grade FPGA delivers 583,000 logic elements, approximately 46 Mbits of embedded memory, and up to 840 I/Os in a 1932-BBGA (FCBGA) package.

Designed for applications that require high logic density, significant on-chip RAM and extensive I/O, the device operates across an industrial temperature range and supports low-voltage core operation for power-sensitive designs.

Key Features

• Core logic  583,000 logic elements for high-density programmable logic integration.
• Embedded memory  Approximately 46 Mbits of on-chip RAM to support buffer, table, and state-storage needs.
• I/O capacity  Up to 840 I/Os to support dense external interfacing and parallel data paths.
• Package and mounting  1932-BBGA (FCBGA) package; supplier device package listed as 1932-FBGA, FC (45×45); surface-mount mounting type.
• Power  Core voltage supply range 820 mV to 880 mV for low-voltage operation.
• Temperature and grade  Industrial grade with operating temperature from −40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• High-density logic designs  Large logic element count and on-chip RAM make the device suitable for complex programmable logic implementations.
• High-I/O systems  Up to 840 I/Os support designs requiring extensive external connectivity and parallel interfacing.
• Industrial control and automation  Industrial temperature range and RoHS compliance support deployment in factory and equipment-level applications.

Unique Advantages

• Substantial logic capacity: 583,000 logic elements enable consolidation of complex functions into a single FPGA.
• Significant on-chip memory: Approximately 46 Mbits of embedded RAM reduces external memory dependency for buffering and state storage.
• Extensive I/O integration: 840 I/Os allow broad peripheral and system interfacing without multiplexing overhead.
• Industrial operating range: Rated from −40 °C to 100 °C for robustness in industrial environments.
• Low-voltage core operation: 820 mV to 880 mV supply range supports power-conscious designs.
• Surface-mount FCBGA packaging: 1932-BBGA (45×45) package supports high-density PCB layouts.

Why Choose 5SGSED6N3F45I3LN?

The 5SGSED6N3F45I3LN combines large logic capacity, substantial embedded memory and a high I/O count in a single industrial-grade Stratix V GS FPGA package. These characteristics make it suitable for designs that need to integrate complex programmable logic, significant buffering or on-chip data storage, and broad external connectivity while operating across a wide temperature range.

Manufactured by Intel and provided in a 1932-BBGA FCBGA surface-mount package, the device offers a compact, high-density option for engineers seeking a scalable FPGA platform with verifiable electrical and operating parameters.

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