5SGSED6N3F45I3N

The 5SGSED6N3F45I3N is a Stratix V GS Field Programmable Gate Array (FPGA) IC designed for high-density, industrial-grade systems. This device integrates approximately 583,000 logic elements and about 46 Mbits of embedded RAM to support complex, resource-intensive digital designs.

With 840 user I/Os, a compact 1932-BBGA (FCBGA) package, and an industrial operating temperature range, the device targets applications that require dense logic, abundant I/O, and reliable operation across –40 °C to 100 °C. Supply voltage is specified between 820 mV and 880 mV, and the device is RoHS compliant.

Key Features

• Core Capacity: Approximately 583,000 logic elements to implement large digital systems and custom hardware accelerators.
• Embedded Memory: Approximately 46 Mbits of on-chip RAM for buffering, lookup tables, and state storage without external memory dependency.
• High I/O Count: 840 available I/Os to support wide parallel interfaces, mixed-signal front-ends, and dense board-level connectivity.
• Package and Mounting: 1932-BBGA (FCBGA) package, supplier device package noted as 1932-FBGA, FC (45×45); designed for surface-mount PCB assembly.
• Industrial Temperature Grade: Rated for operation from –40 °C to 100 °C, suitable for industrial environments.
• Low-Voltage Core: Core supply specified from 820 mV to 880 mV to match system power-rail requirements.
• Compliance: RoHS compliant.

Typical Applications

• Communications and Networking: Implement protocol processing and wide parallel I/O interfaces using high logic density and 840 I/Os.
• High-Density Signal Processing: Use the large logic element count and embedded RAM for custom DSP pipelines and hardware-accelerated algorithms.
• Industrial Control Systems: Deploy in industrial equipment where extended temperature range and surface-mount packaging are required.
• Prototyping and System Integration: Integrate complex custom logic and memory-intensive IP within a single FCBGA package for compact system designs.

Unique Advantages

• Large FPGA Fabric: Approximately 583,000 logic elements enable implementation of sizable custom hardware functions without multiple devices.
• Substantial On-Chip Memory: Around 46 Mbits of embedded RAM reduces dependency on external memory and simplifies board design.
• Extensive I/O Connectivity: 840 I/Os support broad interface requirements and facilitate high-bandwidth parallel interconnects.
• Industrial Reliability: Rated for –40 °C to 100 °C operation to meet industrial deployment needs.
• Compact, High-Pin-Count Package: 1932-BBGA (FCBGA) provides a dense footprint for high-pin-count designs while supporting surface-mount assembly.
• Regulatory Compliance: RoHS compliant for environmentally conscious manufacturing.

Why Choose 5SGSED6N3F45I3N?

The 5SGSED6N3F45I3N combines substantial logic resources, abundant embedded RAM, and a very high I/O count in a single industrial-grade FCBGA package. Its specification set — including an 820 mV to 880 mV core supply and wide operating temperature range — makes it suitable for demanding designs that require both density and environmental robustness.

This device is well suited for engineering teams developing complex signal-processing, communications, and industrial control systems that need on-chip memory, large programmable logic capacity, and extensive I/O without increasing board-level complexity.

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