5SGSED6N3F45C3N

The 5SGSED6N3F45C3N is an Intel Stratix® V GS field-programmable gate array (FPGA) built on a 28‑nm process with an enhanced core architecture and integrated hard IP blocks. This GS variant targets transceiver‑based, DSP‑centric applications and is optimized for bandwidth‑ and data‑intensive systems such as high‑performance digital signal processing, optical transport, and networking protocols including PCIe Gen3.

Key device attributes include 583,000 logic elements, approximately 46 Mbits of embedded memory, abundant variable‑precision DSP resources, and high I/O density, all delivered in a 1932‑ball FCBGA package for surface‑mount applications.

Key Features

• Core & process  28‑nm TSMC process with an enhanced core architecture and integrated hard IP blocks for performance and integration.
• Logic density  583,000 logic elements to implement large, complex logic designs.
• Embedded memory  Approximately 46 Mbits of on‑chip RAM implemented as M20K blocks for buffering, packet memory, and state storage.
• Variable‑precision DSP  GS family devices provide a large array of variable‑precision DSP blocks suitable for high‑precision signal processing workloads.
• High‑speed transceivers  Integrated transceivers with 14.1‑Gbps data‑rate capability for backplane and optical interfaces (Stratix V GS class).
• I/O and package  840 general‑purpose I/Os in a 1932‑BBGA (FCBGA) package (supplier package: 1932‑FBGA, FC, 45×45) in a surface‑mount form factor.
• Power  Core supply operating range from 820 mV to 880 mV for controlled power design and margining.
• Operating range and grade  Commercial grade device with an operating temperature range of 0 °C to 85 °C.
• Standards and compliance  RoHS compliant for regulatory environmental requirements.

Typical Applications

• Optical and packet transport  Use in 40G/100G optical transport and switching systems where high I/O density and transceiver bandwidth are required.
• High‑performance DSP  Signal processing for broadcast, radar, and compute‑intensive applications leveraging abundant variable‑precision DSP blocks.
• Network processing and traffic management  Packet processing and traffic management in networking equipment that require large logic capacity and on‑chip memory.
• Protocol acceleration  Offload and accelerate protocol functions such as PCIe Gen3 endpoints using integrated hard IP blocks.

Unique Advantages

• High logic capacity: 583,000 logic elements enable implementation of large FPGA designs without partitioning across multiple devices.
• Substantial embedded memory: Approximately 46 Mbits of on‑chip RAM simplifies buffer and packet memory design, reducing external memory needs.
• Transceiver bandwidth: Integrated 14.1‑Gbps transceivers support high‑speed backplane and optical interfaces for data‑intensive systems.
• DSP‑centric architecture: Variable‑precision DSP blocks provide flexible multiplier resources for high‑throughput signal processing tasks.
• Dense I/O in an FCBGA package: 840 I/Os in a 1932‑ball FCBGA (45×45) package delivers board‑level connectivity in a compact surface‑mount footprint.
• Commercial temperature and RoHS compliance: Designed for commercial deployments with a 0 °C to 85 °C operating range and RoHS compliance for environmental conformity.

Why Choose 5SGSED6N3F45C3N?

The 5SGSED6N3F45C3N combines high logic density, substantial embedded memory, extensive DSP resources, and high‑speed transceivers in a single Stratix V GS FPGA, making it well suited for designers implementing transceiver‑based, DSP‑heavy designs in networking, optical transport, and high‑performance compute domains. Its surface‑mount 1932‑ball FCBGA package and large I/O count support complex board integrations while the documented core voltage and commercial temperature range provide clear electrical and thermal design boundaries.

For teams requiring a field‑programmable solution with integrated hard IP and scalable DSP capacity, this device provides a balanced platform for prototyping and production deployments within the stated specifications.

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