5SGSED6N3F45C2LG
| Part Description |
Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA |
|---|---|
| Quantity | 785 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Intel |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 26 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 1932-FBGA, FC (45x45) | Grade | Commercial | Operating Temperature | 0°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 1932-BBGA, FCBGA | Number of I/O | 840 | Voltage | 820 mV - 880 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 220000 | Number of Logic Elements/Cells | 583000 | ||
| Number of Gates | N/A | ECCN | N/A | HTS Code | N/A | ||
| Qualification | N/A | Total RAM Bits | 46080000 |
Overview of 5SGSED6N3F45C2LG – Stratix® V GS Field Programmable Gate Array (FPGA) IC
The 5SGSED6N3F45C2LG is a Stratix V GS family FPGA in a 1932-BBGA FCBGA package designed for commercial-grade applications. It integrates 583,000 logic elements and approximately 46.08 Mbits of embedded memory to support complex, high-density programmable logic designs.
With 840 I/O pins, a low-voltage core supply range, and surface-mount packaging, this device addresses designs that require substantial on-chip logic, memory, and high pin-count connectivity while conforming to RoHS requirements.
Key Features
- Core Logic Capacity 583,000 logic elements (cells) to implement large-scale programmable logic and custom processing pipelines.
- Embedded Memory Approximately 46.08 Mbits of on-chip RAM for frame buffers, data buffering, and local storage of intermediate data.
- I/O Density 840 I/O pins provide broad external interfacing capability for multi-channel systems and complex board-level integration.
- Power and Voltage Core supply range of 820 mV to 880 mV, enabling operation within specified low-voltage core conditions.
- Package & Mounting 1932-BBGA, FCBGA package (supplier device package: 1932-FBGA, FC (45×45)) in a surface-mount form factor for compact board integration.
- Operating Temperature & Grade Commercial grade with an operating temperature range of 0°C to 85°C suitable for standard commercial environments.
- Compliance RoHS compliant for use in designs requiring restricted-substance conformance.
Typical Applications
- High-density programmable logic systems Large designs that require extensive logic resources and on-chip interconnect to implement custom accelerators and data-paths.
- On-chip buffering and memory-intensive functions Applications that leverage approximately 46.08 Mbits of embedded RAM for frame buffering, packet buffering, or intermediate data storage.
- High-pin-count interface hubs Board-level designs requiring broad external connectivity across many channels or peripherals, supported by 840 I/O pins.
- Compact surface-mount FPGA modules Designs prioritizing a dense BGA package for space-constrained PCBs while maintaining significant logic and memory capacity.
Unique Advantages
- Substantial logic density: 583,000 logic elements enable consolidation of complex functionality into a single device, reducing system-level component count.
- Significant embedded memory: Approximately 46.08 Mbits of on-chip RAM minimizes external memory dependence for many buffering and storage tasks.
- Extensive I/O availability: 840 I/O pins simplify external interfacing and reduce the need for additional interface chips.
- Space-efficient packaging: 1932-BBGA FCBGA (supplier 1932-FBGA, FC (45×45)) surface-mount package supports high integration on compact PCBs.
- Commercial-grade operating range: Rated for 0°C to 85°C operation to match standard commercial deployment requirements.
- Regulatory compliance: RoHS compliance supports environmental and regulatory conformance in commercial products.
Why Choose 5SGSED6N3F45C2LG?
The 5SGSED6N3F45C2LG combines a high logic element count, ample embedded memory, and a very large I/O complement in a single commercial-grade, surface-mount FCBGA package. It is positioned for projects that require dense, integrated programmable logic and on-chip storage without sacrificing board-level connectivity.
For designers targeting complex programmable systems, this Stratix V GS device offers a balance of integration and practical operating parameters—helping to simplify BOMs and consolidate multi-component designs while maintaining RoHS compliance.
Request a quote or submit an inquiry for pricing and availability of the 5SGSED6N3F45C2LG to begin evaluating it for your next design.

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