5SGSED6N2F45I3LN

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 947 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage820 mV - 880 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N2F45I3LN – Stratix® V GS Field Programmable Gate Array (FPGA)

The 5SGSED6N2F45I3LN is a Stratix V GS family FPGA in a 1932-BBGA FCBGA package, engineered for high-density programmable logic applications. It combines a large logic fabric with substantial embedded memory and a high I/O count, making it suitable for complex system-level designs requiring configurable logic, on-chip RAM, and extensive external connectivity.

Offered in an industrial temperature grade with RoHS compliance, this device targets markets that require reliable, surface-mount FPGA solutions with well-documented electrical characteristics within the Stratix V device family.

Key Features

  • Logic Capacity  Approximately 583,000 logic elements for dense, multi-function logic implementation.
  • Embedded Memory  Approximately 46 Mbits of on-chip RAM to support buffering, packet processing, and other memory-intensive functions.
  • I/O Resources  840 I/O pins to support broad external interfacing and high pin-count system designs.
  • Power  Core supply voltage range of 820 mV to 880 mV to match targeted power and performance operating points.
  • Package & Mounting  1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45×45) in a surface-mount form factor suitable for compact PCBs.
  • Temperature Rating  Industrial operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
  • Compliance  RoHS-compliant manufacturing to meet environmental regulatory requirements.

Typical Applications

  • High-density logic systems  Implement complex finite-state machines, custom datapaths, and protocol engines using the device’s large logic and memory resources.
  • Communication infrastructure  Use the extensive I/O complement and on-chip RAM for packet buffering, interface bridging, and board-level protocol handling.
  • Industrial control and automation  Deploy in control systems that require industrial temperature operation and a high number of I/Os for sensor and actuator connectivity.

Unique Advantages

  • Substantial logic capacity: Approximately 583,000 logic elements enable consolidation of multiple functions into a single device, reducing board-level complexity.
  • Significant embedded memory: Approximately 46 Mbits of on-chip RAM supports data buffering and state storage without immediate reliance on external memory.
  • High I/O count: 840 I/Os provide flexibility for wide parallel buses, multiple interfaces, and dense sensor/actuator connectivity.
  • Industrial temperature rating: −40 °C to 100 °C operation supports deployment in temperature-demanding applications.
  • Compact, high-pin-count packaging: The 1932-BBGA/1932-FBGA (45×45) package delivers a high pin density in a surface-mount footprint suitable for modern PCB layouts.
  • Regulatory readiness: RoHS compliance assists in meeting environmental and manufacturing requirements.

Why Choose 5SGSED6N2F45I3LN?

The 5SGSED6N2F45I3LN provides a balanced combination of large logic capacity, substantial embedded memory, and a very high I/O count in an industrial-grade, surface-mount FPGA. As a member of the Stratix V GS family, it is documented within the Stratix V device datasheet series for electrical and switching characteristics, enabling designers to evaluate operating conditions and power considerations directly from the series documentation.

This device is well suited for engineers and system designers who need a scalable, high-density programmable solution for board-level integration where on-chip memory, abundant I/Os, and industrial temperature performance are required.

Request a quote or submit an inquiry to receive pricing, lead-time, and availability information for the 5SGSED6N2F45I3LN.

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