5SGSED6N3F45C2G

The 5SGSED6N3F45C2G is a Stratix® V GS field programmable gate array (FPGA) offered by Intel. It provides high logic density and substantial on-chip memory in a 1932-BBGA (FCBGA) package for surface-mount assembly.

With 583,000 logic elements, approximately 46.08 Mbits of embedded memory and 840 programmable I/Os, this commercial-grade device targets designs that require large programmable logic resources, significant embedded RAM, and dense I/O connectivity while operating from a low-voltage core supply.

Key Features

• High logic density — 583,000 logic elements for implementing complex custom logic, wide datapaths, or large-scale combinational/sequential designs.
• Embedded memory — Approximately 46.08 Mbits of on-chip RAM to support buffering, LUT-based storage, and data-path acceleration without external memory.
• Rich I/O connectivity — 840 I/O pins to interface with multiple peripherals, parallel buses, or multi-lane systems in high-density applications.
• Power and core supply — Core operating supply specified from 870 mV to 930 mV to match low-voltage power domains.
• Commercial temperature grade — Rated for operation from 0 °C to 85 °C for standard commercial environments.
• Package and mounting — 1932-BBGA, FCBGA (supplier package: 1932-FBGA, FC 45 × 45) in a surface-mount format for compact, high-pin-count board layouts.
• Regulatory status — RoHS compliant.

Typical Applications

• High-density custom logic — Implement complex, large-scale logic functions and custom accelerators that require hundreds of thousands of logic elements and substantial on-chip RAM.
• Data buffering and packet processing — Use the embedded memory (approximately 46.08 Mbits) and large I/O count to manage data flows, queues, and packet-level buffering.
• Multi-I/O interface hubs — Leverage 840 I/Os to consolidate and bridge multiple parallel interfaces, sensors, or expansion buses on a single device.

Unique Advantages

• Extensive programmable fabric: 583,000 logic elements provide the capacity to implement large, integrated systems on a single FPGA, reducing the need for multiple devices.
• Large on-chip memory: Approximately 46.08 Mbits of embedded RAM lowers dependence on external memory, simplifying board design and improving local data throughput.
• Very high I/O count: 840 I/Os enable dense external connectivity and flexible pinout options for complex system interconnects.
• Compact BGA packaging: 1932-BBGA (45 × 45 supplier footprint) enables a high pin count in a space-efficient surface-mount package suitable for advanced PCBs.
• Commercial-grade operation: Rated 0 °C to 85 °C with a defined core supply range (870 mV–930 mV) for predictable behavior in commercial environments.
• Standards-compliant material status: RoHS compliance supports environmental and procurement requirements.

Why Choose 5SGSED6N3F45C2G?

The 5SGSED6N3F45C2G places a high-density Stratix V GS FPGA into a compact FCBGA package, combining 583,000 logic elements, approximately 46.08 Mbits of embedded memory, and 840 I/Os. Its core supply window and commercial temperature rating make it suitable for demanding, board-level designs that need large programmable resources and extensive connectivity.

Engineers and system designers seeking a single-device solution to consolidate logic, memory, and I/O will find this device useful for reducing component count and simplifying system architecture while relying on documented Stratix V family electrical characteristics and Intel manufacturing pedigree.

Request a quote or submit an inquiry for part number 5SGSED6N3F45C2G to check availability, lead times, and tailored ordering options.