5SGSED6N1F45C2N

IC FPGA 840 I/O 1932FBGA
Part Description

Stratix® V GS Field Programmable Gate Array (FPGA) IC 840 46080000 583000 1932-BBGA, FCBGA

Quantity 1,289 Available (as of May 6, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package1932-FBGA, FC (45x45)GradeCommercialOperating Temperature0°C – 85°C
Package / Case1932-BBGA, FCBGANumber of I/O840Voltage870 mV - 930 mV
Mounting MethodSurface MountRoHS ComplianceRoHS CompliantREACH ComplianceREACH Unknown
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs220000Number of Logic Elements/Cells583000
Number of GatesN/AECCN3A001A2CHTS Code8542.39.0001
QualificationN/ATotal RAM Bits46080000

Overview of 5SGSED6N1F45C2N – Stratix® V GS FPGA, 583,000 logic elements, 1932‑BBGA

The 5SGSED6N1F45C2N is a Stratix® V GS Field Programmable Gate Array (FPGA) in a 1932‑BBGA (FCBGA) package designed for transceiver‑based, DSP‑centric designs. Built on the Stratix V family architecture, this device combines a high logic element count with abundant variable‑precision DSP resources, integrated transceivers, and embedded memory to address demanding bandwidth and signal‑processing use cases.

This commercial‑grade, surface‑mount FPGA targets applications such as high‑performance computing, wireline and broadcast DSP, and optical/backplane interfaces where large on‑chip memory, extensive I/O, and transceiver connectivity are required.

Key Features

  • Device Core and Process  Stratix V family architecture implemented on 28‑nm process technology with a core supply range of 870 mV to 930 mV for efficient core operation.
  • Logic Capacity  583,000 logic elements to implement large, complex logic and control functions.
  • Embedded Memory  Approximately 46 Mbits of on‑chip RAM (46,080,000 bits) using M20K embedded memory blocks for buffering, FIFOs, and large local storage.
  • DSP Resources  Abundant variable‑precision DSP blocks for high‑throughput multiply/accumulate workloads; Stratix V GS devices include support for large numbers of multipliers suited to precision DSP pipelines.
  • High‑Speed Transceivers  Integrated transceivers with 14.1‑Gbps data‑rate capability (Stratix V GS variant) to support backplane and optical interface requirements.
  • Hard IP and ASIC Path  Embedded HardCopy block enables hardened IP instantiation (including PCIe Gen1/Gen2/Gen3), supporting a low‑risk migration path to HardCopy V ASICs for production scaling.
  • I/O and Packaging  Up to 840 I/O pins in a 1932‑BBGA / 1932‑FBGA (45×45) supplier package; surface‑mount mounting for standard PCB assembly.
  • Operating Conditions and Compliance  Commercial grade with an operating temperature range of 0 °C to 85 °C and RoHS compliance.

Typical Applications

  • High‑Performance DSP and HPC: Implement large‑scale signal processing pipelines and acceleration engines using the device's extensive DSP resources and on‑chip memory.
  • Optical and Backplane Interfaces: Support 14.1‑Gbps transceiver links for 40G/100G optical transport, backplane, and high‑speed serial interfaces.
  • Wireline and Network Processing: Enable packet processing, traffic management, and network test functions that require high I/O density and programmable logic capacity.
  • Prototyping Toward ASICs: Use the Embedded HardCopy block and Stratix V family roadmap as a low‑risk prototyping path to HardCopy V ASICs for volume production.

Unique Advantages

  • High logic and memory density: 583,000 logic elements combined with approximately 46 Mbits of embedded RAM supports complex designs with large local storage needs.
  • DSP‑centric architecture: Variable‑precision DSP blocks and support for numerous multipliers accelerate compute‑intensive signal processing tasks.
  • Integrated high‑speed transceivers: 14.1‑Gbps capable transceivers reduce the need for external PHYs in backplane and optical applications.
  • Hard IP and scalable production path: The Embedded HardCopy block simplifies hardening of interfaces such as PCIe and enables a clear migration route to HardCopy V ASICs.
  • Broad I/O and compact package: 840 I/Os in a 1932‑BBGA package deliver extensive board‑level connectivity while supporting surface‑mount assembly.
  • Commercial‑grade, RoHS‑compliant: Designed for standard commercial temperature ranges (0 °C to 85 °C) and RoHS compliance for regulatory alignment.

Why Choose 5SGSED6N1F45C2N?

The 5SGSED6N1F45C2N positions itself as a scalable, DSP‑focused solution within the Stratix V GS family, offering a combination of high logic capacity, significant embedded memory, and integrated transceiver bandwidth. It is well suited to engineers building complex signal‑processing, networking, and optical interface systems that need programmable flexibility during development and a clear path to hardened ASIC implementations.

Choose this device when your design requires substantial on‑chip compute and memory resources, extensive I/O, and the transceiver support to interface with high‑speed serial networks, all within a commercial‑grade, RoHS‑compliant FPGA package.

Request a quote or submit an RFQ to receive pricing, availability, and lead‑time information for the 5SGSED6N1F45C2N.

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