5SGSED6K3F40I3LN

The 5SGSED6K3F40I3LN is an Intel Stratix® V GS field-programmable gate array (FPGA) supplied in a 1517-BBGA FCBGA package. It delivers a high-density programmable fabric with 583,000 logic elements and approximately 46 Mbits of embedded memory for demanding logic and buffer requirements.

Designed for industrial-grade deployments, this device supports a wide operating temperature range and a large I/O count, making it suitable for systems that require high logic capacity, substantial on-chip memory, and extensive external interfacing while operating from a low core voltage.

Key Features

• Core Logic Capacity  583,000 logic elements provide significant programmable logic resources for complex designs and high-density implementations.
• Embedded Memory  Approximately 46 Mbits of on-chip RAM to support large data buffers, FIFOs, and local storage for compute-intensive tasks.
• I/O Density  696 I/O pins available for broad interfacing options with external devices, sensors, and high-pin-count peripherals.
• Power and Voltage  Core supply voltage range specified at 820 mV to 880 mV to align with Stratix V GS core power requirements.
• Package  1517-BBGA, FCBGA (supplier package: 1517-FBGA, 40×40) surface-mount package for compact board-level integration.
• Industrial Temperature Grade  Rated for operation from –40 °C to 100 °C to support industrial and harsh-environment applications.
• Mounting  Surface-mount package suitable for automated PCB assembly and dense system boards.
• Standards and Compliance  RoHS compliant as indicated in the product environmental specifications.

Typical Applications

• High-density signal processing  Use the large logic element count and embedded RAM for FPGA-based DSP pipelines, image processing, and data aggregation tasks.
• Industrial control and instrumentation  Industrial temperature rating (–40 °C to 100 °C) makes this device suitable for control systems and instrumentation in challenging environments.
• I/O-intensive systems  With 696 I/Os, the device is well suited for designs that require extensive external connectivity, parallel interfaces, or multi-channel data acquisition.
• Prototyping and advanced system integration  High logic capacity and a dense BGA package support system-level prototyping and integration where board real estate is constrained.

Unique Advantages

• High programmable capacity: 583,000 logic elements enable significant on-chip integration of control, processing, and custom logic, reducing the need for discrete glue logic.
• Substantial on-chip memory: Approximately 46 Mbits of embedded RAM reduce external memory bandwidth requirements and simplify memory subsystem design.
• Large I/O complement: 696 I/Os allow flexible partitioning of interfaces and parallel data lanes without immediate need for I/O expanders.
• Industrial temperature rating: Specified –40 °C to 100 °C operation supports deployment in temperature-challenging installations.
• Compact, assembly-friendly package: 1517-BBGA (1517-FBGA, 40×40) surface-mount package supports high-density PCB layouts and automated assembly flows.
• RoHS compliant: Meets common environmental compliance requirements for lead-free manufacturing processes.

Why Choose 5SGSED6K3F40I3LN?

The 5SGSED6K3F40I3LN pairs the Stratix V GS family’s high-density logic and on-chip memory with industrial-grade thermal performance and a high I/O count. It is positioned for engineers who need a programmable platform with significant logic and embedded RAM capacity, broad interfacing capability, and ruggedized temperature range for demanding system-level designs.

This device is appropriate for teams developing complex signal-processing, control, or integration-heavy systems that require scalability and a mature device family foundation. Its package and electrical specifications support compact board designs and predictable power/thermal planning.

Request a quote or submit a product inquiry to obtain pricing, availability, and configuration support for 5SGSED6K3F40I3LN. Our team can provide the detailed purchasing information you need to move your design forward.