A54SX32A-BG329

IC FPGA 249 I/O 329BGA
Part Description

SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

Quantity 1,052 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerMicrochip Technology
Manufacturing StatusActive
Manufacturer Standard Lead Time20 Weeks
Datasheet

Specifications & Environmental

Device Package329-PBGA (31x31)GradeCommercialOperating Temperature0°C – 70°C
Package / Case329-BBGANumber of I/O249Voltage2.25 V - 5.25 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs2880Number of Logic Elements/Cells2880
Number of Gates48000ECCN3A991DHTS Code8542.39.0001
QualificationN/A

Overview of A54SX32A-BG329 – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA

The A54SX32A-BG329 is a commercial-grade FPGA from Microchip Technology's SX‑A family, delivered as a nonvolatile, single‑chip programmable logic device. It provides 48,000 system gates implemented across 2,880 logic elements with up to 249 user I/O pins in a 329‑ball BGA package.

Designed for commercial embedded applications that require flexible mixed‑voltage I/O and deterministic timing, the device combines high internal performance (up to 350 MHz) and robust system performance (up to 250 MHz) with features such as hot‑swap compliant I/Os, JTAG boundary‑scan, and on‑chip security mechanisms.

Key Features

  • Core Capacity: 48,000 system gates realized across 2,880 logic elements, suitable for medium-complexity programmable logic and control functions.
  • I/O and Voltage Flexibility: Up to 249 user‑programmable I/O pins with configurable support for multiple voltage standards; device supplies operate from 2.25 V to 5.25 V and support mixed‑voltage operation.
  • Performance: Series-level performance targets include up to 250 MHz system performance and up to 350 MHz internal performance for timing‑sensitive logic paths.
  • Power-Up and Hot-Swap Friendly: I/O design supports hot‑swap operation and power‑up/down behavior that does not require strict supply sequencing.
  • Standards and Test: 66 MHz PCI compliance and IEEE 1149.1 (JTAG) boundary‑scan testing are supported for in‑system testability and legacy bus interfacing.
  • Security and Diagnostics: Actel Secure Programming Technology with FuseLock™ for protection against reverse engineering and in‑system diagnostic/verification capability with Silicon Explorer II.
  • Package and Mounting: 329‑ball BGA package (product package case: 329‑BBGA; supplier device package listed as 329‑PBGA 31×31) and surface‑mount mounting type.
  • Commercial Temperature Grade: Rated for 0 °C to 70 °C operating temperature and RoHS‑compliant packaging.
  • Memory: No on‑chip RAM (Total RAM bits: 0), enabling designs that rely on external memory or are optimized for combinational and flip‑flop based logic.

Typical Applications

  • Interface Bridging and Glue Logic: Use the A54SX32A-BG329 for board‑level protocol translation and glue logic where mixed‑voltage I/O and configurable pin behavior are required.
  • PCI and Peripheral Interfaces: Leverage the device's 66 MHz PCI compliance and 5 V tolerant I/Os for interfacing with PCI‑based subsystems and legacy peripherals.
  • Embedded Control and State Machines: Implement control logic, sequencers, and finite state machines using the 2,880 logic elements and dedicated flip‑flop resources.
  • In‑System Test and Diagnostics: Integrate boundary‑scan (IEEE 1149.1) and Silicon Explorer II diagnostics for manufacturing test and in‑system verification.

Unique Advantages

  • Nonvolatile Single‑Chip Solution: Eliminates external configuration memory and simplifies system boot and configuration management.
  • Mixed‑Voltage I/O Flexibility: Supports 2.5 V, 3.3 V, and 5 V operation with 5 V input tolerance and configurable I/O standards, reducing the need for level‑shifters on mixed‑voltage boards.
  • Deterministic Timing: User‑controllable timing characteristics help designers achieve predictable timing closure for critical interfaces.
  • Security‑Oriented Programming: FuseLock™ technology provides a hardware mechanism to protect designs against reverse engineering and unauthorized access.
  • Testability and Diagnostics: Boundary‑scan support plus in‑system diagnostic capability streamline board bring‑up and field troubleshooting.
  • Compact, Surface‑Mount BGA Package: 329‑ball BGA footprint enables high I/O density in a compact form factor for board‑space constrained designs.

Why Choose A54SX32A-BG329?

The A54SX32A-BG329 offers a balance of moderate logic capacity, high I/O count, and mixed‑voltage flexibility in a commercial‑grade, nonvolatile FPGA. Its combination of up to 48,000 system gates, 2,880 logic elements, and up to 249 user I/Os makes it well suited for commercial embedded designs that require deterministic timing, in‑system testability, and programmable security.

For teams standardizing on the SX‑A family, the A54SX32A provides a middle‑capacity option that scales within the family while delivering RoHS‑compliant packaging and surface‑mount board integration for production environments.

Request a quote or submit a sourcing inquiry to begin evaluation and procurement of the A54SX32A-BG329 for your next commercial embedded design.

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