A54SX32A-BG329I
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 986 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | RoHS non-compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32A-BG329I – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32A-BG329I is a member of the SX-A family of nonvolatile, single‑chip FPGAs from Microchip Technology. It delivers a combination of deterministic timing, mixed‑voltage I/O flexibility and on‑chip logic density designed for industrial applications.
This device provides 48,000 system gates implemented across 2,880 logic elements, 249 user I/Os, and a wide supply range (2.25 V to 5.25 V). Family-level performance characteristics include up to 250 MHz system performance and up to 350 MHz internal performance.
Key Features
- Core & Performance SX-A family performance: 250 MHz system performance and up to 350 MHz internal performance for demanding logic and timing needs.
- Logic Resources 48,000 system gates delivered through 2,880 logic elements and up to 1,800 dedicated flip‑flops (family device allocations shown in datasheet).
- I/O & Interfaces 249 user‑programmable I/Os with configurable support for mixed I/O standards; family supports 3.3 V/5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2 signaling and 5 V input tolerance.
- Power & Mixed‑Voltage Operation Supported supply range 2.25 V to 5.25 V and mixed 2.5 V, 3.3 V and 5 V operation with 5 V drive strength where applicable, simplifying interfaces to legacy and modern peripherals.
- Package & Industrial Grade Surface‑mount 329‑BBGA (329‑PBGA 31×31) package and industrial temperature grade (−40 °C to 85 °C) for robust deployment in industrial environments.
- System Reliability & Boot Nonvolatile, single‑chip configuration removes the need for external configuration memory and supports power‑up/power‑down friendly operation without supply sequencing.
- I/O Robustness Hot‑swap compliant I/Os and configurable weak pull‑ups/pull‑downs on power‑up; individual output slew rate control for signal integrity management.
- Diagnostics & Test In‑system diagnostic capability (Silicon Explorer II) and IEEE 1149.1 JTAG boundary‑scan testing for board‑level validation and field diagnostics.
- Security Actel Secure Programming Technology with FuseLock™ to protect intellectual property and prevent reverse engineering.
- Compliance RoHS compliant packaging.
Typical Applications
- PCI and legacy bus interfaces Use the device's 66 MHz PCI compliance and mixed‑voltage I/O support to implement PCI endpoints, glue logic, or bridge functions.
- Industrial control and automation Industrial temperature rating (−40 °C to 85 °C), hot‑swap I/O capability and a high I/O count make it suitable for motor control, I/O aggregation and machine‑control fabrics.
- Mixed‑voltage system glue logic Ideal for designs that must interface between 5 V legacy components and 3.3 V/2.5 V modern devices, reducing external level‑shifting components.
- Field‑upgradable/secure systems Nonvolatile on‑chip configuration plus FuseLock™ security and in‑system diagnostics support secure, serviceable products with protected firmware.
Unique Advantages
- Deterministic, controllable timing: Family features provide deterministic timing control for predictable system behavior and timing closure.
- Nonvolatile single‑chip solution: Eliminates external configuration memory, reducing BOM and simplifying board layout.
- Wide supply and mixed‑voltage I/O: 2.25 V to 5.25 V supply range and family support for multiple I/O standards simplify integration with diverse peripherals.
- High I/O density: 249 user I/Os provide extensive connectivity for sensors, buses and peripheral interfaces without external multiplexing.
- Industrial readiness: Surface‑mount 329‑BBGA package and −40 °C to 85 °C operating range support deployment in industrial environments.
- Built‑in security and diagnostics: FuseLock™ protection and Silicon Explorer II diagnostics help safeguard IP and speed fault isolation during development and in the field.
Why Choose A54SX32A-BG329I?
The A54SX32A-BG329I combines the SX-A family’s nonvolatile single‑chip architecture with a substantial logic footprint (48,000 system gates, 2,880 logic elements) and a high I/O count (249). Its mixed‑voltage support, hot‑swap I/Os and deterministic timing features make it suited for industrial and mixed‑signal systems that require reliable interfacing and predictable timing.
Backed by family-level diagnostics, JTAG boundary‑scan, and on‑chip security, this device is a strong fit for designs that prioritize integration, hardware-level IP protection and long‑term field serviceability while maintaining compact BOM and board space.
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