A54SX32A-BGG329I
| Part Description |
SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA |
|---|---|
| Quantity | 507 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | Microchip Technology |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 20 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 329-PBGA (31x31) | Grade | Industrial | Operating Temperature | -40°C – 85°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 329-BBGA | Number of I/O | 249 | Voltage | 2.25 V - 5.25 V | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 3 (168 Hours) | Number of LABs/CLBs | 2880 | Number of Logic Elements/Cells | 2880 | ||
| Number of Gates | 48000 | ECCN | 3A991D | HTS Code | 8542.39.0001 | ||
| Qualification | N/A |
Overview of A54SX32A-BGG329I – SX-A Field Programmable Gate Array (FPGA) IC 249 329-BBGA
The A54SX32A-BGG329I is a nonvolatile SX-A family FPGA in a 329-ball BGA package designed for programmable logic implementations requiring a high I/O count and mixed-voltage operation. This device provides 48,000 system gates and 2,880 logic elements with up to 249 user-programmable I/Os, offering deterministic timing and in-system diagnostic capabilities.
Designed for mixed-voltage environments, the device supports a 2.25 V to 5.25 V supply range and an industrial operating temperature range of -40 °C to 85 °C. Family-level performance figures include up to 250 MHz system performance and up to 350 MHz internal performance.
Key Features
- Core Capacity and Performance 48,000 system gates and 2,880 logic elements provide programmable resources; family-level performance is specified up to 250 MHz system and up to 350 MHz internal operation.
- I/O and Mixed-Voltage Support Up to 249 user I/Os with configurable I/O support for 3.3 V / 5 V PCI, 5 V TTL, 3.3 V LVTTL and 2.5 V LVCMOS2. Supports 2.5 V, 3.3 V and 5 V mixed-voltage operation with 5 V input tolerance and 5 V drive strength.
- Nonvolatile Single-Chip Architecture Nonvolatile, single-chip solution eliminates the need for external configuration memory and supports in-system programmability and verification.
- Power and Hot-Swap Friendly Power-up/power-down friendly operation (no sequencing required) and hot-swap compliant I/Os. Configurable weak pull-up/pull-down options at power-up and individual output slew-rate control.
- Security and Testability Actel Secure Programming Technology with FuseLock to protect design IP and support for IEEE 1149.1 boundary-scan (JTAG) testing. In-system diagnostic and verification capability with Silicon Explorer II.
- Package and Environmental 329-ball BGA (supplier package 329-PBGA, 31×31) surface-mount device, RoHS compliant, industrial grade with an operating temperature range of -40 °C to 85 °C.
- Supply Voltage Range Wide supply tolerance from 2.25 V to 5.25 V for flexible system integration.
- Embedded Memory Product specification lists no dedicated on-chip RAM bits (Total RAM Bits: 0), enabling deterministic logic resource planning based on logic elements and flip-flop resources.
Typical Applications
- PCI-based Systems — 66 MHz PCI compliance and configurable 3.3 V/5 V PCI I/O support make the device suitable for PCI add-in logic and bus-bridge functions.
- Mixed-Voltage Interface and Level Translation — Mixed-voltage I/O support and wide supply range enable bridging and interface logic between 2.5 V, 3.3 V and 5 V domains.
- Industrial Control and Embedded Logic — Industrial-grade temperature rating (-40 °C to 85 °C) and high I/O density support control, automation and embedded processing tasks requiring reliable field operation.
- Secure and Testable Programmable Logic — Built-in FuseLock security and IEEE 1149.1 boundary-scan support address requirements for IP protection and board-level testability.
Unique Advantages
- Nonvolatile, Single-Chip Solution: Eliminates external configuration memory and simplifies system boot sequencing.
- High I/O Density: Up to 249 user-programmable I/Os in a compact 329-ball BGA package enables dense interface designs.
- Wide Supply and Mixed-Voltage Operation: 2.25 V to 5.25 V supply range with 5 V-tolerant I/Os for flexible integration across voltage domains.
- Industrial Temperature Range: Rated for -40 °C to 85 °C to meet industrial deployment requirements.
- Security and In-System Verification: FuseLock programming technology and Silicon Explorer II support protect IP and enable in-system diagnostics and verification.
- Deterministic Timing and Resource Utilization: SX-A family features such as user-controllable timing and resource utilization help in predictable design closure and pin locking.
Why Choose A54SX32A-BGG329I?
The A54SX32A-BGG329I delivers a balanced mix of programmable capacity, I/O density and mixed-voltage flexibility in a nonvolatile single-chip FPGA. With 48,000 system gates, 2,880 logic elements and up to 249 I/Os in a 329-ball BGA footprint, it is suited to designs that require deterministic timing, on-board configurability and built-in test and security features.
Its industrial temperature rating, wide supply range and hot-swap/power-sequencing tolerant I/Os make it appropriate for robust embedded and industrial applications. Built-in boundary-scan, in-system diagnostics and secure programming features support long-term maintainability and IP protection throughout the product lifecycle.
Request a quote or submit a pricing and availability inquiry to receive lead-time and ordering information for the A54SX32A-BGG329I.

Date Founded: 1989
Headquarters: Chandler, Arizona, USA
Employees: 22,000+
Revenue: $8.349 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016, AS 9100D