EP1K50FC256-1N

The EP1K50FC256-1N is an ACEX-1K series programmable logic device optimized for cost-efficient system-on-a-programmable-chip (SOPC) integration. It combines a logic array and embedded memory architecture to deliver mid-density FPGA capability suitable for commercial applications that require reconfigurable logic and embedded RAM.

With 2,880 logic elements, approximately 40,960 bits of embedded RAM and 186 I/O pins in a 256-BGA package, this device targets designs needing moderate gate density, flexible I/O, and compact surface-mount packaging.

Key Features

• Logic Capacity — 2,880 logic elements providing up to 199,000 system gates for mid-density programmable logic integration.
• Embedded Memory — Approximately 40,960 total RAM bits with multiple embedded array blocks capable of dual-port operation and up to 16-bit width per block for efficient megafunction and buffer implementations.
• I/O Flexibility — 186 user I/O pins with MultiVolt I/O capability described in the ACEX-1K family, supporting mixed-voltage interfacing and programmable output options.
• Power and Supply — Designed to operate with an internal 2.5 V supply; device supply range is 2.375 V to 2.625 V as specified for this part number.
• Package & Mounting — 256-ball fine-pitch BGA (256-FBGA, 17×17) in a surface-mount package for compact board layouts and high pin density.
• Commercial Temperature Grade — Rated for 0 °C to 70 °C operating temperature and specified as Commercial grade.
• Test and Configuration — Family-level features include IEEE 1149.1 JTAG boundary-scan for in-system test and support for in-circuit reconfigurability via external configuration devices or JTAG.
• RoHS Compliant — Device is compliant with RoHS requirements.

Typical Applications

• Communications Modules — Implement protocol bridging, buffering, and control logic using the device’s embedded RAM and dedicated logic resources for mid-density communications tasks.
• Embedded Control — Ideal for control-plane logic, state machines, and interfacing functions where reconfigurable logic and multiple I/O standards are required.
• Perimeter Logic and Glue — Use as board-level glue logic to consolidate discrete components, implement custom bus logic, or perform signal conditioning between mixed-voltage domains.
• Prototype and Product Iteration — Useful for rapid iteration of digital designs that benefit from reprogrammability and integrated memory blocks in a compact BGA package.

Unique Advantages

• Balanced Logic and Memory Integration: 2,880 logic elements combined with roughly 40,960 bits of embedded RAM enable implementation of control logic plus moderate on-chip buffers without external memory.
• Flexible I/O in a Compact Footprint: 186 I/O pins in a 256-FBGA (17×17) package deliver high pin count for dense designs while keeping board area small.
• Commercial-Grade Reliability: Specified commercial operating range (0 °C to 70 °C) and surface-mount packaging suit a wide range of standard electronic products.
• In-System Test and Reconfiguration: JTAG boundary-scan and in-circuit reconfigurability options simplify debug, manufacturing test, and field updates.
• Standards-Based Design Support: ACEX-1K family features such as dual-port embedded arrays and documented I/O options enable predictable integration into existing digital designs.
• Regulatory Compliance: RoHS compliance supports environmentally conscious product development and supply-chain requirements.

Why Choose EP1K50FC256-1N?

The EP1K50FC256-1N positions itself as a cost-efficient, mid-density FPGA solution for commercial applications that need a balance of logic capacity, embedded memory, and flexible I/O in a compact BGA package. Its combination of 2,880 logic elements, roughly 40,960 bits of on-chip RAM, and 186 I/O pins makes it well suited for designers consolidating glue logic, control systems, or communication interfaces while maintaining a small board footprint.

Backed by ACEX‑1K family capabilities such as in-circuit reconfigurability, JTAG boundary-scan, and MultiVolt I/O options, this device offers a practical platform for teams focused on rapid development cycles and scalable designs within commercial temperature ranges.

If you would like a quote or further purchasing information for EP1K50FC256-1N, submit a request or contact sales to get pricing, availability, and lead-time details.