EP1K50FC256-2N

The EP1K50FC256-2N is an ACEX-1K family field programmable gate array (FPGA) IC from Intel designed for cost-sensitive, medium-density programmable logic applications. It combines a logic array with embedded array blocks (EABs) to deliver integrated memory and specialized logic functions suited for system-on-a-programmable-chip (SOPC) designs.

With 2,880 logic elements, approximately 40.96 kbits of on-chip RAM, 186 I/O pins, and a 256-pin BGA package, this commercial-grade device targets communications, embedded control, and interface-bridging applications that require reconfigurable logic, dual-port embedded memory, and flexible I/O voltage support.

Key Features

• Logic Capacity — 2,880 logic elements providing up to 199,000 maximum system gates for medium-density logic integration.
• Embedded Memory (EABs) — Approximately 40,960 bits of on-chip RAM implemented across embedded array blocks with dual-port capability and up to 16-bit width per EAB for efficient memory-intensive functions.
• I/O and Voltage Flexibility — 186 user I/O pins with MultiVolt I/O support capable of interfacing with 2.5 V, 3.3 V, or 5.0 V devices, enabling mixed-voltage system integration.
• Package and Mounting — 256-ball FineLine BGA (256-FBGA, 17×17) surface-mount package for compact board-level integration.
• Power and Supply — Operates with a supply range of 2.375 V to 2.625 V and an internal 2.5 V core supply.
• Clocking and Performance Options — Family-level features include low-skew global clock distribution, ClockLock and ClockBoost options for reduced clock delay and skew, and dedicated carry/cascade chains for high-speed arithmetic and high-fan-in logic.
• Configuration and Test — Supports in-circuit reconfigurability via external configuration devices or JTAG; built-in IEEE 1149.1 boundary-scan test (JTAG) for board-level testability without consuming device logic.
• Design Flow Support — Family datasheet documents software design support and automatic place-and-route tools to streamline development and implementation.
• Environmental Compliance — RoHS compliant and specified for commercial operating temperatures from 0 °C to 70 °C.

Typical Applications

• Communications Interfaces — Implement protocol bridging, packet preprocessing, or custom interface logic where on-chip RAM and medium-density logic reduce external component count.
• Embedded Control and SOPC — Integrate control logic, state machines, and embedded memory blocks for compact system-on-a-programmable-chip solutions.
• Custom Logic Acceleration — Offload application-specific functions such as signal formatting, parallel processing, or arithmetic acceleration using dedicated carry chains and reconfigurable logic.
• Board-Level Prototyping and Field Upgrades — Use in-circuit reconfigurability and JTAG for iterative development, firmware updates, and field reprogramming without hardware changes.

Unique Advantages

• Balanced Integration: Combines 2,880 logic elements with embedded dual-port RAM to deliver a compact solution for designs that need both logic and on-chip memory, reducing external components.
• Flexible I/O Voltage Support: MultiVolt I/O capability enables direct interfacing with multiple logic families, simplifying board-level voltage translation requirements.
• Compact, High-Density Packaging: 256-FBGA (17×17) surface-mount package provides a small board footprint while supporting a substantial number of I/O pins for medium-complexity systems.
• Development Ecosystem: Documented support for automated place-and-route and toolchains streamlines design implementation and shortens time to prototype.
• Field Serviceability: In-circuit reconfigurability and JTAG boundary-scan test facilitate firmware updates and board-level diagnostics without redesigning hardware.

Why Choose EP1K50FC256-2N?

The EP1K50FC256-2N positions itself as a cost-effective, medium-density FPGA option for commercial-temperature systems needing a balance of logic capacity, embedded memory, and flexible I/O. Its combination of 2,880 logic elements, approximately 40.96 kbits of on-chip RAM, and 186 I/O pins in a compact 256-FBGA package makes it suitable for communications interfaces, embedded controllers, and SOPC-style integrations where board space and BOM reduction matter.

Backed by family-level design tools and features such as JTAG, in-circuit reconfigurability, and dedicated arithmetic/cascade chains, this device supports efficient development cycles and practical field updates, helping teams scale from prototype to production with predictable integration and testing options.

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