EP1K50FC484-1N

IC FPGA 249 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 249 40960 2880 484-BBGA

Quantity 307 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O249Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceUnknownREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50FC484-1N – ACEX-1K® Field Programmable Gate Array (FPGA) IC 249 40960 2880 484-BBGA

The EP1K50FC484-1N is an ACEX-1K family field programmable gate array (FPGA) optimized for system-on-a-programmable-chip (SOPC) integration and memory‑intensive logic functions. As a programmable logic device, it combines a dedicated embedded array architecture with a general-purpose logic array to support efficient implementation of specialized logic, dual-port memories, and high-density logic.

This commercial-grade device targets high-volume, cost-sensitive applications such as communications and system integration where multi-volt I/O flexibility, in-circuit reconfigurability, and a compact BGA package are valuable design attributes.

Key Features

  • Logic Capacity — 2,880 logic elements providing a logic resource scaled for medium-density FPGA designs; supports up to 199,000 system gates as a family characteristic.
  • Embedded Memory (EABs) — Family-level enhanced embedded array blocks (EABs) support dual-port operation and efficient memory megafunctions; this device provides approximately 40,960 bits of on-chip RAM for data buffering and small on-chip storage.
  • I/O and System Signals — 249 user I/O pins and support for up to six global clocks and multiple global clears as provided by the ACEX-1K architecture for flexible clocking and I/O integration.
  • Package — Surface-mount 484-BBGA supplied in a 484-FBGA (23×23) footprint, enabling compact board-level integration and high I/O density.
  • Power and Supply — Operates with a 2.5‑V internal supply and a voltage supply range of 2.375 V to 2.625 V for core operation.
  • Configuration and Test — In-circuit reconfigurability via external configuration devices, an intelligent controller, or JTAG; built-in JTAG boundary-scan (IEEE Std. 1149.1) available without consuming device logic.
  • Performance and Interconnect — FastTrack continuous routing and dedicated carry and cascade chains for arithmetic and high‑fan‑in logic functions to improve predictable routing and performance.
  • Commercial Temperature Range — Rated for operation from 0 °C to 70 °C for commercial applications.
  • RoHS Compliant — Device is RoHS compliant.

Typical Applications

  • Communications Equipment — Implement protocol bridging, interface logic and buffering using the device’s on-chip RAM and flexible I/O to support multi-volt signaling.
  • SOPC and System Integration — Integrate memory megafunctions and specialized logic in a single programmable device to reduce board-level component count and simplify system design.
  • Embedded Logic and Control — Use the dedicated carry and cascade chains for arithmetic accelerators, counters, and control functions in mid-density embedded designs.
  • PCI and Legacy Interfaces — Family features include PCI Local Bus Specification support for certain speed grades and flexible I/O options useful when bridging to standard bus interfaces.

Unique Advantages

  • Balanced integration — Combines 2,880 logic elements with approximately 40,960 bits of embedded RAM for mixed logic-and-memory implementations without additional external memory in many designs.
  • Flexible I/O and signaling — 249 I/O pins and family-level MultiVolt I/O capability support interfacing to 2.5-V, 3.3-V, or 5.0-V devices where required by the system architecture.
  • Reconfigurability and testability — In-circuit reconfigurability and built-in JTAG boundary-scan enable field updates and board-level test without consuming user logic.
  • Predictable routing and performance — FastTrack interconnect and dedicated arithmetic/cascade chains deliver predictable delays for timing-sensitive functions.
  • Compact board footprint — 484-BBGA / 484-FBGA (23×23) package provides high I/O density in a small surface-mount package for space-constrained designs.

Why Choose EP1K50FC484-1N?

The EP1K50FC484-1N positions itself as a mid-density, commercial-grade FPGA that brings together embedded dual-port memory blocks, a sizable logic element count, and broad I/O in a compact BGA package. It is suited to designs that require SOPC integration, memory-backed logic functions, and flexible interfacing while maintaining cost-efficiency for higher-volume deployments.

With family-level software design support, automatic place-and-route tools, and proven architecture features such as FastTrack interconnect and dedicated carry/cascade resources, this device is appropriate for engineering teams seeking a predictable, reconfigurable building block for communications, embedded control, and system integration projects.

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