EP1K50FC484-2

IC FPGA 249 I/O 484FBGA
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 249 40960 2880 484-BBGA

Quantity 678 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package484-FBGA (23x23)GradeCommercialOperating Temperature0°C – 70°C
Package / Case484-BBGANumber of I/O249Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50FC484-2 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 249 40960 2880 484-BBGA

The EP1K50FC484-2 is an ACEX-1K family field programmable gate array (FPGA) from Intel, designed for cost-efficient system-on-a-programmable-chip (SOPC) integration. It combines a dedicated logic array and embedded memory resources to implement megafunctions, dual-port memory, and general-purpose logic in a single surface-mount device.

With 2,880 logic elements, approximately 40,960 bits of embedded RAM, and up to 249 I/O pins in a 484-BBGA package, this device targets high-density, high-integration applications that require flexible I/O, in-circuit reconfigurability, and a compact BOM footprint.

Key Features

  • Logic Capacity — 2,880 logic elements and a maximum of approximately 199,000 system gates provide substantial on-chip logic for control, state machines, and custom datapaths.
  • Embedded Memory — Approximately 40,960 bits of RAM and multiple embedded array blocks (EABs) support dual-port memory configurations and efficient implementation of on-chip buffers and FIFOs.
  • I/O and Voltage — Up to 249 user I/O pins with MultiVolt I/O capability; device operates with an internal 2.5-V supply and a specified supply range of 2.375 V to 2.625 V.
  • Package and Mounting — Surface-mount 484-BBGA (supplier package 484-FBGA, 23×23) for high-density board layouts and reliable fine-pitch mounting.
  • Clocking and Performance — Built-in low-skew clock distribution trees and options for reduced clock delay and skew support synchronous designs and higher-frequency I/O timing.
  • Configuration and Test — In-circuit reconfigurability via external configuration devices or JTAG; built-in JTAG boundary-scan test (IEEE 1149.1) for board-level testability without consuming user logic.
  • Compliance and Environmental — Commercial grade operation from 0 °C to 70 °C; RoHS compliant material and manufacturing.

Typical Applications

  • Communications Equipment — Implement protocol bridging, packet buffering, and interface logic using embedded RAM and abundant I/O to reduce external components.
  • SOPC and Megafunction Integration — Integrate memory-intensive megafunctions and custom logic in a single device for compact system designs.
  • PCI and Bus Interface Logic — Use the device in bus interface and local bus applications leveraging the family’s PCI compatibility features at supported voltage levels.
  • In-System Programmable Designs — Take advantage of in-circuit reconfigurability and JTAG for field updates, iterative development, and board-level testing.

Unique Advantages

  • Highly integrated solution: 2,880 logic elements and approximately 40,960 bits of embedded RAM reduce the need for external glue logic and discrete memory, simplifying PCB design.
  • Flexible I/O and Voltage support: Up to 249 I/O pins plus MultiVolt I/O capability enable direct interfacing to a wide range of voltage domains and legacy peripherals.
  • Compact, board-friendly package: 484-BBGA surface-mount package provides high pin density in a compact footprint for space-constrained designs.
  • Design and testability: Integrated JTAG boundary-scan and in-circuit reconfigurability streamline manufacturing test and field updates without consuming user logic.
  • Vendor ecosystem and tools support: ACEX-1K family design support includes synthesis, place-and-route, and megafunction libraries to accelerate development and migration within the family.
  • Regulatory and environmental compliance: RoHS compliant manufacturing and commercial temperature grading align with common electronics industry requirements.

Why Choose EP1K50FC484-2?

The EP1K50FC484-2 positions itself as a practical, high-density FPGA choice for designers seeking to consolidate memory and logic into a single programmable device. Its balance of logic elements, embedded RAM, and abundant I/O in a compact 484-BBGA package makes it well suited for communications, bus-interface, and SOPC-style implementations where board space and BOM count are critical.

Backed by Intel’s ACEX-1K family development ecosystem and proven configuration and test features, the EP1K50FC484-2 offers a scalable platform for mid-range FPGA designs that require field reconfiguration, reliable board testability, and commercial-grade operation.

Request a quote or submit a purchase inquiry for the EP1K50FC484-2 to receive pricing and availability details for your project.

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