EP1K50FC484-2N

The EP1K50FC484-2N is an ACEX-1K family programmable logic device optimized for system-on-a-programmable-chip (SOPC) integration. It combines a dedicated logic array with embedded memory blocks to implement memory-intensive megafunctions and general-purpose logic in a single surface-mount package.

With 2,880 logic elements, approximately 40,960 bits of embedded RAM, and 249 user I/O pins, this commercial-grade device addresses designs that require medium-density logic, flexible I/O voltage support, and in-circuit reconfigurability for communications and embedded applications.

Key Features

• Core Logic  — 2,880 logic elements and up to 199,000 system gates provide a mid-density programmable fabric for custom logic implementation.
• Embedded Memory (EAB)  — Approximately 40,960 total RAM bits with EABs supporting dual-port operation and up to 4,096 bits per embedded array block; EABs can be used without reducing logic capacity.
• I/O and Voltage  — 249 user I/O pins with MultiVolt I/O capability to interface with 2.5-V, 3.3-V, or 5.0-V devices; device operates with a 2.5-V internal supply and a supply voltage range of 2.375 V to 2.625 V.
• Clocking and Timing  — Built-in low-skew clock distribution, options for ClockLock™ and ClockBoost™ to reduce clock delay and skew, and up to six global clock signals and four global clear signals for complex timing architectures.
• Interconnect and Arithmetic Support  — FastTrack® continuous routing structure for predictable delays, dedicated carry and cascade chains for high-speed adders and high-fan-in logic, and tri-state emulation for internal bus architectures.
• Configuration and Test  — In-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port; built‑in JTAG boundary-scan (IEEE 1149.1) for test and programming support; I/O pull-ups before and during configuration.
• Package and Mounting  — 484‑BBGA surface-mount package (supplier device package: 484‑FBGA, 23×23) for compact board-level integration.
• Commercial Operating Range and Compliance  — Commercial grade with an operating temperature range of 0 °C to 70 °C and RoHS compliance.

Typical Applications

• Communications Equipment  — Medium-density protocol bridging, interface logic, and buffer/memory functions where integrated dual-port embedded RAM and flexible I/O voltages are required.
• Embedded Systems and SOPC  — Implementation of megafunctions, customized control logic, and embedded memory blocks for compact system integration.
• Consumer and Commercial Electronics  — Interface control, glue logic, and feature integration in commercial-grade products that require moderate logic capacity and multiple I/O standards.
• Data Path Acceleration  — Use of dedicated carry/cascade chains and embedded RAM for arithmetic blocks, counters, and specialized data processing pipelines.

Unique Advantages

• Balanced Logic and Memory:  2,880 logic elements paired with approximately 40,960 bits of embedded RAM enable combined logic-plus-memory functions without extensive external components.
• Flexible I/O Voltage Support:  MultiVolt I/O capability allows direct interfacing to 2.5-V, 3.3-V, or 5.0-V devices, simplifying mixed-voltage board designs.
• Mid-Density Integration:  Up to 249 user I/O and the 484-BBGA package deliver a compact footprint with ample pinout for medium-complexity designs.
• Design and Test Support:  Built-in JTAG boundary-scan and in-circuit reconfigurability streamline programming and manufacturing test flows.
• Deterministic Routing and Arithmetic Support:  FastTrack routing plus dedicated carry and cascade chains help realize predictable timing and efficient arithmetic implementations.

Why Choose EP1K50FC484-2N?

The EP1K50FC484-2N positions itself as a commercial-grade, mid-density FPGA option within the ACEX-1K family, combining a balanced mix of logic elements, embedded RAM, and flexible I/O to simplify SOPC-style integration. Its package density and I/O flexibility make it appropriate for communications, embedded control, and other commercial electronic designs that require integrated memory and versatile interfacing without moving to larger device families.

Designers benefit from family-level features such as dual-port embedded arrays, dedicated arithmetic chains, and built-in JTAG configuration/test that support reliable development and production workflows. The device’s RoHS compliance and standardized package options support streamlined procurement and assembly for volume production.

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