EP1K50FI256-2

The EP1K50FI256-2 is an ACEX-1K family field programmable gate array (FPGA) offering a balance of logic capacity, embedded memory, and flexible I/O for industrial applications. It combines a logic array with embedded array blocks (EABs) and in-circuit reconfigurability to support system-on-a-programmable-chip integration, including memory-mapped functions and specialized logic.

With 2,880 logic elements, 40,960 bits of embedded RAM, and 186 user I/O pins in a 256-FBGA surface-mount package, this device is positioned for medium-density designs that require multi-voltage I/O capability, predictable timing structures, and industrial temperature operation.

Key Features

• Core logic — 2,880 logic elements providing the programmable combinational and sequential resources needed for glue logic, state machines, and moderate-density processing tasks; maximum system gates listed at 199,000 for the EP1K50 device class.
• Embedded memory (EABs) — Total RAM of 40,960 bits across multiple embedded array blocks, with dual-port capability and up to 16-bit width per EAB for efficient on-chip storage and megafunction implementations.
• I/O and voltage flexibility — 186 user I/O pins with MultiVolt capability to interface with 2.5-V, 3.3-V, or 5.0-V devices. I/O features include individual tri-state enable, open-drain option, programmable slew-rate control, and clamp-to-VCCIO selection per pin.
• Package and thermal — Surface-mount 256-FBGA (17×17) package; industrial-grade operation from −40 °C to 85 °C, RoHS-compliant.
• Power and configuration — Operates with an internal 2.5-V supply and external supply range of 2.375 V to 2.625 V; supports in-circuit reconfigurability via external configuration devices, intelligent controller, or JTAG port.
• System and timing features — Built-in JTAG boundary-scan test (BST) circuitry, low-skew clock distribution trees, ClockLock and ClockBoost options, up to six global clock signals and four global clear signals, and dedicated carry/cascade chains for fast arithmetic and high-fan-in logic.
• Routing and tool support — FastTrack interconnect architecture for predictable routing delays; software design support and automatic place-and-route provided by development systems with interfaces for Verilog, VHDL, LPM, and common EDA tools.

Typical Applications

• Communications equipment — Implement protocol glue logic, packet buffering, and specialized processing blocks using on-chip EAB memory and flexible I/O.
• System integration / SOPC — Integrate controllers, interfaces, and custom peripherals on a single device to reduce board-level complexity and BOM count.
• Industrial control — Handle sensor interfacing, motor-control logic, and deterministic I/O tasks across an industrial temperature range.
• Memory interfacing and buffering — Use dual-port EABs for efficient on-chip FIFOs, small memory arrays, and memory-mapped megafunctions.

Unique Advantages

• Highly integrated medium-density FPGA: 2,880 logic elements combined with 40,960 bits of embedded RAM reduce external component needs for many control and buffering tasks.
• Flexible voltage interoperability: MultiVolt I/O support and programmable pin options simplify board-level interfacing to 2.5-V, 3.3-V, and 5.0-V devices.
• On-chip dual-port memory: EAB blocks with dual-port capability and up to 16-bit widths enable efficient implementation of FIFOs and shared memory structures.
• Reconfigurability and testability: JTAG boundary-scan and in-circuit reconfiguration allow field updates and streamlined manufacturing test without consuming device logic.
• Predictable timing and arithmetic support: FastTrack routing, dedicated carry and cascade chains, and multiple global clocks support reliable timing closure for common FPGA functions.
• Industrial robustness and packaging: 256-FBGA surface-mount package with −40 °C to 85 °C operating range and RoHS compliance for industrial deployments.

Why Choose EP1K50FI256-2?

The EP1K50FI256-2 delivers a practical balance of programmable logic, embedded memory, and flexible I/O in a RoHS-compliant, industrial-grade package. It is well suited for designers who need medium-density logic and on-chip RAM for communications, control, and system-integration tasks while maintaining board-level simplicity.

Supported by development-system design flows and common EDA tool interfaces, the device offers predictable migration and package compatibility within the ACEX-1K family, enabling design scalability and reuse across similar FineLine BGA package options.

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