EP1K50QC208-1

IC FPGA 147 I/O 208QFP
Part Description

ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

Quantity 303 Available (as of May 5, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerIntel
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeRFQ
Datasheet

Specifications & Environmental

Device Package208-PQFP (28x28)GradeCommercialOperating Temperature0°C – 70°C
Package / Case208-BFQFPNumber of I/O147Voltage2.375 V - 2.625 V
Mounting MethodSurface MountRoHS ComplianceRoHS non-compliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level3 (168 Hours)Number of LABs/CLBs360Number of Logic Elements/Cells2880
Number of Gates199000ECCN3A991DHTS Code8542.39.0001
QualificationN/ATotal RAM Bits40960

Overview of EP1K50QC208-1 – ACEX-1K® Field Programmable Gate Array (FPGA) IC 147 40960 2880 208-BFQFP

The EP1K50QC208-1 is an ACEX-1K series field programmable gate array (FPGA) IC from Intel designed for commercial embedded logic and system-on-a-programmable-chip (SOPC) integration. It combines on-chip logic, embedded memory, and flexible I/O to support communications, embedded control, and high-volume commercial applications.

As a member of the ACEX-1K family, this -1 speed grade device benefits from the series architecture for embedded arrays, multi-voltage I/O options, and in-circuit reconfigurability, delivering a compact, surface-mount solution in a 208-pin BFQFP package.

Key Features

  • Logic Capacity  Provides 2,880 logic elements (LEs) and a maximum system gate capacity of 199,000 gates for implementing combinational and sequential logic.
  • Embedded Memory  Includes approximately 40,960 bits of on-chip RAM via embedded array blocks (EABs) to support dual-port memory and efficient megafunction implementations.
  • I/O and Voltage  147 user I/O pins with MultiVolt I/O capability; device operates with an internal 2.5 V supply and supports I/O interfacing across a range of voltages. Supply voltage: 2.375 V to 2.625 V.
  • Package and Mounting  Surface-mount 208-BFQFP package (supplier device package: 208-PQFP, 28×28) for compact PCB designs and reliable board-level assembly.
  • System Features  Family-level features include dual-port EABs, dedicated carry and cascade chains, up to six global clocks, and FastTrack interconnect for predictable routing delays.
  • Configuration and Test  Supports in-circuit reconfigurability and built-in JTAG boundary-scan test (IEEE 1149.1) for programming and board-level test without consuming logic resources.
  • Clocking Options  ClockLock and ClockBoost options (family-level) reduce clock delay and skew and support clock multiplication where required by the design.
  • Commercial Temperature Grade  Rated for 0 °C to 70 °C operating temperature for commercial applications.
  • RoHS Compliant  Manufactured to meet RoHS requirements.

Typical Applications

  • Communications Equipment  Implement protocol handling, packet buffering, and timing functions using the device’s embedded RAM and logic resources.
  • PCI-Based I/O Cards  Family-level PCI Local Bus compatibility for -1 speed grade devices enables use in 3.3 V or 5.0 V PCI implementations on expansion cards.
  • Embedded Control and SOPC  Combine logic, RAM, and flexible I/O to implement custom controllers, glue logic, and system-level integration in compact boards.
  • Prototyping and Volume Designs  Surface-mount 208-BFQFP packaging supports both development prototypes and cost-sensitive, high-volume commercial products.

Unique Advantages

  • Balanced Logic and Memory  2,880 logic elements paired with approximately 40,960 bits of embedded RAM provide a practical balance for designs that require both combinational logic and block RAM.
  • Flexible I/O Voltage Support  MultiVolt I/O capability and a narrow internal supply range facilitate interfacing with a variety of peripheral voltage domains.
  • In-Circuit Reconfigurability  Supports in-system reprogramming and JTAG access for iterative development, updates, and board-level testing without extra logic consumption.
  • Compact, Surface-Mount Package  208-pin BFQFP (28×28 PQFP footprint) offers high pin count in a standard surface-mount form factor suitable for compact commercial PCBs.
  • Series-Level Clock and Routing Enhancements  ClockLock/ClockBoost options and FastTrack interconnect provide reduced clock skew and predictable routing for timing-sensitive designs.
  • Vendor Toolchain Support  ACEX-1K family-level documentation and development tools support design entry, place-and-route, and megafunction integration to accelerate development.

Why Choose EP1K50QC208-1?

The EP1K50QC208-1 delivers a practical combination of logic density, embedded memory, and flexible I/O in a commercial-grade, surface-mount 208-BFQFP package. It is well suited to designers seeking a cost-efficient, reconfigurable device for communications, embedded control, and SOPC-style integration while leveraging family-level features such as dual-port embedded arrays, JTAG programmability, and clock-management options.

This device is appropriate for projects that require predictable routing, modest on-chip RAM, and the ability to interface across multiple voltage domains, backed by the ACEX-1K family’s development tool support and tested device architecture.

Request a quote for EP1K50QC208-1 or submit a procurement inquiry to receive pricing and availability information tailored to your project requirements.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 1968


    Headquarters: Santa Clara, California, USA


    Employees: 130,000+


    Revenue: $54.23 Billion


    Certifications and Memberships: ISO9001:2015, ISO14001:2015, ISO17025:2017, ISO27001:2022, ISO45001:2018, ISO50001:2018


    Featured Products
    Latest News
    keyboard_arrow_up